公开(公告)号：US20100218985A1

公开(公告)日：2010-09-02

申请号：US12702616

申请日：2010-02-09

Applicant: Takuya KOUYA

Inventor： Takuya KOUYA

IPC: H05K1/18 ,  H05K1/11 ,  B05D5/12

CPC classification number: H05K1/0204 ,  H01L23/142 ,  H01L24/16 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/13099 ,  H01L2224/16225 ,  H01L2224/2919 ,  H01L2224/29191 ,  H01L2224/29339 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/484 ,  H01L2224/48599 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01068 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/1517 ,  H01L2924/157 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/3011 ,  H01L2924/30111 ,  H05K1/021 ,  H05K3/4682 ,  H05K2201/09054 ,  Y10T428/24917 ,  H01L2924/0715 ,  H01L2924/0665 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/01004 ,  H01L2224/85399 ,  H01L2224/05599

Abstract: An integrated circuit mounted board includes a printed wiring board and an integrated circuit bare chip mounted on the printed wiring board. The printed wiring board includes a metal base, an insulating member made of an insulating material and disposed on the metal base, and a wiring pattern disposed on the insulating member. The wiring pattern includes an electrode part to which the integrated circuit bare chip is electrically coupled. The insulating member includes an under region being opposite to the electrode part. The metal base includes a metal substrate and a metal portion protruding from the metal substrate. The metal portion is buried in the under region of the insulating member.

Abstract translation: 集成电路安装板包括安装在印刷线路板上的印刷线路板和集成电路裸芯片。 印刷布线板包括金属基底，由绝缘材料制成并设置在金属基底上的绝缘构件和布置在绝缘构件上的布线图案。 布线图案包括集成电路裸芯片电耦合到的电极部分。 绝缘构件包括与电极部相对的下部区域。 金属基底包括金属基底和从金属基底突出的金属部分。 金属部分埋在绝缘部件的下部区域。