公开(公告)号：US20050040263A1

公开(公告)日：2005-02-24

申请号：US10470510

申请日：2002-01-29

Applicant: Terrence Parke

Inventor： Terrence Parke

IPC: B02C18/00 ,  B02C18/14 ,  B02C18/16 ,  B02C18/18 ,  B02C18/22 ,  B02C18/24

CPC classification number: B02C18/16 ,  B02C18/142 ,  B02C18/182 ,  B02C2018/0069 ,  B02C2018/164 ,  B02C2201/04 ,  Y10S241/31

Abstract: A self cleaning cutting assembly is provided, having an array of counter rotating cutters in which a plurality of cutters rotating in a first direction are mounted on a first shaft and a plurality of second cutters are mounted on a second shaft for rotating in an opposite direction. The array of cutters is provided with a plurality of clearing or cleaning rings located alternately with the cutters on each shaft. The cutting array is kept clear of debris or partially cut material by movement of the clearing or cutting rings against adjacent cutters. Movement of the clearing or cleaning rings is a combination of rotary motion and linear motion, in which the linear motion is imparted by the cutter located opposite the cleaning ring striking the cleaning rings so as to push the cleaning ring beyond the position of the widest part of the cutter to completely dislodge material from the cutter.

Abstract translation: 提供一种自清洁切割组件，其具有反转旋转刀具阵列，其中沿第一方向旋转的多个切割器安装在第一轴上，并且多个第二切割器安装在第二轴上以沿相反方向旋转 。 切割器阵列设置有与每个轴上的切割器交替设置的多个清洁或清洁环。 通过将清扫或切割环移动到相邻的切割器上，切割阵列保持清除碎屑或部分切割的材料。 清洁环或清洁环的移动是旋转运动和线性运动的组合，其中线性运动由位于清洁环相对的切割器施加到清洁环上，以将清洁环推至超过最宽部分的位置 的切割器以完全从切割器移除材料。