Adhesive for copper foils and adhesive-backed copper foil
    1.
    发明授权
    Adhesive for copper foils and adhesive-backed copper foil 失效
    用于铜箔和粘合剂背衬铜箔的粘合剂

    公开(公告)号:US5707729A

    公开(公告)日:1998-01-13

    申请号:US524802

    申请日:1995-09-07

    Applicant: Tetsuro Satoh

    Inventor: Tetsuro Satoh

    Abstract: An adhesive composition and foils coated with the adhesive, wherein the adhesive consisting essentially of: (I) a fist amount of a non-modified epoxy resin and a second amount of a rubber-modified epoxy resin in a total amount of 60-100 parts by weight, wherein the amount of rubber-modified epoxy resin is 0.5 to 20 parts by weight; (II) 5-30 parts by weight of a polyvinyl acetal resin; and optionally contains (III) at least one resin selected rom the group consisting of blocked isocyanate resins, polyester resins, polyester resins, melamine resins and urethane resins. The adhesive coating can optionally contain inorganic fillers, fire retardants, and curing agents.

    Abstract translation: 粘合剂组合物和涂有粘合剂的箔,其中粘合剂基本上由以下组成:(I)第一量的未改性环氧树脂和第二量橡胶改性环氧树脂,总量为60-100份 ,其中橡胶改性环氧树脂的量为0.5-20重量份; (II)5-30重量份的聚乙烯醇缩醛树脂; 并且任选地含有(III)选自由封端异氰酸酯树脂,聚酯树脂,聚酯树脂,三聚氰胺树脂和聚氨酯树脂组成的组中的至少一种树脂。 粘合剂涂层可以任选地含有无机填料,阻燃剂和固化剂。

Patent Agency Ranking