-
公开(公告)号：US09049794B2
公开(公告)日：2015-06-02
申请号：US13075865
申请日：2011-03-30
Applicant: Yoshihiro Morita , Takahiro Ooi , Tetsuro Yamada , Akiko Matsui , Mitsuhiko Sugane , Takahide Mukoyama
Inventor： Yoshihiro Morita , Takahiro Ooi , Tetsuro Yamada , Akiko Matsui , Mitsuhiko Sugane , Takahide Mukoyama
CPC classification number: H05K1/0366 , D03D1/0088 , D03D15/0011 , D03D15/0088 , D10B2401/18 , D10B2505/02 , H05K1/024 , H05K1/0245 , H05K1/0248 , H05K2201/029 , H05K2201/091 , H05K2203/0195 , Y10T29/49124
Abstract: A wiring substrate includes an insulation layer including a thermosetting resin and a reinforcement member having plural first fiber bundles and plural second fiber bundles woven together, the second fiber bundles being intersected with the first fiber bundles, and a pair of differential wirings arranged alongside each other on the insulation layer. The first fiber bundles and the second fiber bundles have a curved portion relative to a plan direction of the insulation layer in a region on which the pair of differential wirings is arranged.
Abstract translation: 布线基板包括：绝缘层，包括热固性树脂和具有多个第一纤维束的加强件和编织在一起的多个第二纤维束，第二纤维束与第一纤维束相交，以及一对彼此并排设置的差动布线 在绝缘层上。 第一纤维束和第二纤维束在布置有一对差动布线的区域中相对于绝缘层的平面方向具有弯曲部分。
-
公开(公告)号：US08648260B2
公开(公告)日：2014-02-11
申请号：US13075838
申请日：2011-03-30
Applicant: Takahiro Ooi , Yoshihiro Morita , Akiko Matsui , Tetsuro Yamada , Mitsuhiko Sugane , Takahide Mukoyama
Inventor： Takahiro Ooi , Yoshihiro Morita , Akiko Matsui , Tetsuro Yamada , Mitsuhiko Sugane , Takahide Mukoyama
CPC classification number: H05K1/0248 , H05K1/024 , H05K1/0245 , H05K1/0269 , H05K1/0366 , H05K2201/029 , H05K2201/09272 , H05K2203/166 , H05K2203/167
Abstract: A wiring substrate includes differential wirings; a first insulating layer adjacent to one side of the differential wirings, including first fiber bundles parallel to the differential wirings; a second insulating layer adjacent to another side of the differential wirings, including second fiber bundles parallel to the differential wirings and disposed by the same pitch as the first fiber bundles; a third insulating layer on the first insulating layer on a side opposite to the differential wirings, including third fiber bundles in parallel to the differential wirings; and a fourth insulating layer on the second insulating layer on a side opposite to the differential wirings, including fourth fiber bundles in parallel to the differential wirings. Intervals of the third and fourth fiber bundles are respectively narrower than intervals of the first and second fiber bundles. The differential wirings are disposed between adjacent first fiber bundles, and between adjacent second fiber bundles.
Abstract translation: 布线基板包括差分布线; 与所述差分布线的一侧相邻的第一绝缘层，包括平行于所述差分布线的第一光纤束; 与所述差分布线的另一侧相邻的第二绝缘层，包括与所述差分布线平行并且以与所述第一纤维束相同的间距设置的第二纤维束; 在所述第一绝缘层上的与所述差分布线相反的一侧的第三绝缘层，包括与所述差分布线平行的第三纤维束; 以及在所述第二绝缘层上的与所述差分布线相反的一侧的第四绝缘层，包括与所述差分布线平行的第四纤维束。 第三和第四纤维束的间隔分别比第一和第二纤维束的间隔窄。 差分布线设置在相邻的第一纤维束之间以及相邻的第二纤维束之间。
-
公开(公告)号：US5038575A
公开(公告)日：1991-08-13
申请号：US518291
申请日：1990-05-04
Applicant: Tetsuro Yamada
Inventor： Tetsuro Yamada
CPC classification number: F25D21/008 , F25B2700/2117 , F25D2700/122
Abstract: A refrigerator having an enclosed compartment for storing food to be cooled, an evaporator including a refrigerant flowing therethrough for cooling the food in the compartment, a defrosting device, and a defrost override device. The defrosting device periodically heats the evaporator for removing the accumulated frost for controlled periods. The defrost override device automatically deactivates the defrosting device when the heating of the evaporator continues for longer than a preset time. The defrost override device may also automatically activate the refrigerant flowing through the evaporator. In this manner the refrigerator of this invention can store food without overheating during the defrosting operation.
Abstract translation: 一种冰箱，具有用于储存要冷却的食物的封闭隔室，包括流过其中的制冷剂以冷却隔室中的食物的蒸发器，除霜装置和除霜超控装置。 除霜装置周期性地加热蒸发器以除去累积的霜冻受控制的时间。 当蒸发器的加热持续时间超过预设时间时，除霜装置自动停用除霜装置。 除霜超控装置还可以自动激活流过蒸发器的制冷剂。 以这种方式，本发明的冰箱可以在除霜操作期间储存食物而不会过热。
-
公开(公告)号：US4959651A
公开(公告)日：1990-09-25
申请号：US200893
申请日：1988-06-01
Applicant: Tetsuro Yamada
Inventor： Tetsuro Yamada
CPC classification number: G01K7/25
Abstract: A temperature detector including a temperature sensor to generate an analog voltage corresponding to a temperature detected thereby. The temperature detector is provided with an A/D conversion device to generate digital temperature data corresponding to the analog voltage input thereto, a reference voltage range setting device to set the reference voltage range to the A/D conversion device, and a reference voltage range changing device. The A/D conversion device compares the analog voltage with the reference voltage which varies within the set reference voltage range. The reference voltage range is automatically changed by the reference voltage range changing device not only to obtain a desired resolution of temperature in a normal operating mode, but also to detect a malfunction of the temperature sensor in a malfunction detection mode.
Abstract translation: 一种温度检测器，包括温度传感器，以产生对应于由此检测的温度的模拟电压。 温度检测器设置有A / D转换装置，用于产生与输入的模拟电压相对应的数字温度数据，将参考电压范围设定为A / D转换装置的基准电压范围设定装置以及基准电压范围 改变装置 A / D转换装置将模拟电压与在设定的参考电压范围内变化的参考电压进行比较。 参考电压范围改变装置自动改变参考电压范围，不仅可以在正常工作模式下获得期望的温度分辨率，而且可以在故障检测模式下检测温度传感器的故障。
-
公开(公告)号：US08958211B2
公开(公告)日：2015-02-17
申请号：US13300701
申请日：2011-11-21
Applicant: Yoshiyuki Hiroshima , Akiko Matsui , Mitsuhiko Sugane , Takahide Mukoyama , Tetsuro Yamada , Takahiro Ooi
Inventor： Yoshiyuki Hiroshima , Akiko Matsui , Mitsuhiko Sugane , Takahide Mukoyama , Tetsuro Yamada , Takahiro Ooi
CPC classification number: H05K1/181 , H05K1/18 , H05K2201/099
Abstract: An electronic device includes an electronic component including a plurality of terminals and a circuit board on which the electronic component is mounted. The circuit board includes a board body, a plurality of electrode pads arranged on the board body, each of the electrode pads being connected to each of the terminals by solder, a first solder resist formed on the board body and having a plurality of first openings, each of the first openings accommodating each of the electrode pads, and a second solder resist formed on the first solder resist and having a plurality of second openings, each of the second openings being larger than each of the first openings and communicating with each of the first openings.
Abstract translation: 一种电子设备包括一个包括多个端子的电子部件和一个安装有电子部件的电路板。 电路板包括板体，布置在板体上的多个电极焊盘，每个电极焊盘通过焊料连接到每个端子;第一阻焊剂，形成在电路板主体上，并具有多个第一开口 每个所述第一开口容纳每个所述电极焊盘;以及第二阻焊剂，形成在所述第一阻焊层上，并且具有多个第二开口，每个所述第二开口大于每个所述第一开口， 第一个开口。
-
Patent Agency Ranking
公开(公告)号：US08631568B2
公开(公告)日：2014-01-21
申请号：US13046076
申请日：2011-03-11
Applicant: Tetsuro Yamada , Takahiro Ooi , Yoshihiro Morita , Akiko Matsui , Misuhiko Sugane , Takahide Mukoyama
Inventor： Tetsuro Yamada , Takahiro Ooi , Yoshihiro Morita , Akiko Matsui , Misuhiko Sugane , Takahide Mukoyama
IPC: H05K3/02
CPC classification number: H05K1/0245 , H05K1/0248 , H05K1/0269 , H05K1/0366 , H05K3/4638 , H05K2201/029 , H05K2201/09236 , H05K2201/0969 , H05K2203/167
Abstract: A printed wiring board manufacturing method includes weaving a glass fiber cloth with warp and weft yarns such that the warp and weft yarns are visually distinguishable at least a region. The glass fiber cloth is impregnated with a resin to fabricate a substrate. A copper foil is formed on at least one surface of the substrate to fabricate a core substrate. The copper foil is removed within the region on the core substrate to form an opening. A pitch between the warp yarns or between the weft yarns which are presented in the opening is detected. A pitch between a pair of differential wirings to be patterned is determined based on the detected pitch between the warp yarns or between the weft yarns. The pair of differential wirings is patterned on the core substrate in accordance with the determined pitch between the pair of differential wirings.
Abstract translation: 一种印刷线路板的制造方法，其特征在于，以经纱和纬纱编织玻璃纤维布，使经纱和纬纱在至少一个区域上视觉区分。 玻璃纤维布被树脂浸渍以制造基材。 在基板的至少一个表面上形成铜箔以制造芯基板。 在芯基板上的区域内去除铜箔以形成开口。 检测出在经纱之间或介于纬纱之间的间距。 基于经纱之间或纬纱之间的间距来确定要被图案化的一对差动布线之间的间距。 根据所述一对差动配线之间的所确定的间距，在所述芯基板上图案化所述一对差分布线。
-
公开(公告)号：US20130142990A1
公开(公告)日：2013-06-06
申请号：US13807757
申请日：2011-07-01
Applicant: Akihiro Suzuki , Kohji Kamiya , Tetsuro Yamada
Inventor： Akihiro Suzuki , Kohji Kamiya , Tetsuro Yamada
CPC classification number: B32B3/08 , B29C45/0055 , B29C45/14467 , B29C45/1657 , B29C45/1676 , B29C45/1704 , B29C2045/0058 , B29C2045/1668 , B29L2031/3005 , B29L2031/302 , B60J7/16 , B60J10/20 , B60J10/34 , B60J10/365 , B60J10/70 , Y10T428/24289
Abstract: A method for manufacturing a composite molded article including: preparing a main body member to which a through hole is formed to a peripheral wall by removing a protruding portion protruding from a face of the peripheral wall surrounding a hollow space in the main body member having the hollow space formed therein along the longitudinal direction; setting the main body member in an injection molding die; forming a cushion member molding cavity by the main body member and a molding die face formed inside the injection molding die in the longitudinal direction of the main body member and allowing the through hole to communicate with the cavity; and filling a heated and melted elastic polymer material injected from an injection gate into the cavity and the hollow space from the through hole, thereby forming a cushion member and a filling portion.
Abstract translation: 一种复合成形体的制造方法，其特征在于，具有：将具有通孔的主体部件形成为周壁的步骤，该主体部件通过从具有所述主体部件的主体部件中的围绕中空空间的周壁的表面突出的突出部 沿纵向形成在其中的中空空间; 将主体部件设置在注射成型模具中; 通过主体构件形成缓冲构件成型腔，以及在主体构件的纵向方向上形成在注射成型模具内部的成型模面，并允许通孔与空腔连通; 以及将从注射口注入的加热熔融的弹性聚合物材料从通孔填充到空腔和中空空间中，由此形成缓冲构件和填充部分。
-
8.发明授权Cable connector, circuit board and system having circuit boards connected together by the cable connector 失效电缆连接器，电路板和具有通过电缆连接器连接在一起的电路板的系统
公开(公告)号：US5667401A
公开(公告)日：1997-09-16
申请号：US455532
申请日：1995-05-31
Applicant: Kiyoshi Kuwabara , Tetsuro Yamada , Takeshi Nishiyama , Masahiko Sakuraoka
Inventor： Kiyoshi Kuwabara , Tetsuro Yamada , Takeshi Nishiyama , Masahiko Sakuraoka
IPC: H01R9/09
CPC classification number: H01R12/716 , H01R12/724 , H01R12/732 , H01R12/75 , H01R12/79
Abstract: A cable connector includes cables, and jacks attached to ends of the cables. The jacks have contacts connected to the cables. The contacts extend in a first direction substantially perpendicular to a second direction in which the cables extend from the jacks.
Abstract translation: 电缆连接器包括电缆和连接到电缆端部的插座。 插座具有连接到电缆的触点。 触头沿基本上垂直于电缆从插孔延伸的第二方向的第一方向延伸。
-
公开(公告)号：US09073286B2
公开(公告)日：2015-07-07
申请号：US13807757
申请日：2011-07-01
Applicant: Akihiro Suzuki , Kohji Kamiya , Tetsuro Yamada
Inventor： Akihiro Suzuki , Kohji Kamiya , Tetsuro Yamada
CPC classification number: B32B3/08 , B29C45/0055 , B29C45/14467 , B29C45/1657 , B29C45/1676 , B29C45/1704 , B29C2045/0058 , B29C2045/1668 , B29L2031/3005 , B29L2031/302 , B60J7/16 , B60J10/20 , B60J10/34 , B60J10/365 , B60J10/70 , Y10T428/24289
Abstract: A method for manufacturing a composite molded article including: preparing a main body member to which a through hole is formed to a peripheral wall by removing a protruding portion protruding from a face of the peripheral wall surrounding a hollow space in the main body member having the hollow space formed therein along the longitudinal direction; setting the main body member in an injection molding die; forming a cushion member molding cavity by the main body member and a molding die face formed inside the injection molding die in the longitudinal direction of the main body member and allowing the through hole to communicate with the cavity; and filling a heated and melted elastic polymer material injected from an injection gate into the cavity and the hollow space from the through hole, thereby forming a cushion member and a filling portion.
Abstract translation: 一种复合成形体的制造方法，其特征在于，具有：将具有通孔的主体部件形成为周壁的步骤，该主体部件通过从具有所述主体部件的主体部件中的围绕中空空间的周壁的表面突出的突出部 沿纵向形成在其中的中空空间; 将主体部件设置在注射成型模具中; 通过主体构件形成缓冲构件成型腔，以及在主体构件的纵向方向上形成在注射成型模具内部的成型模面，并允许通孔与空腔连通; 以及将从注射口注入的加热熔融的弹性聚合物材料从通孔填充到空腔和中空空间中，由此形成缓冲构件和填充部分。
-
公开(公告)号：US08513537B2
公开(公告)日：2013-08-20
申请号：US12859829
申请日：2010-08-20
Applicant: Takahiro Ooi , Tetsuro Yamada , Yoshihiro Morita , Akiko Matsui , Mitsuhiko Sugane , Takahide Mukouyama
Inventor： Takahiro Ooi , Tetsuro Yamada , Yoshihiro Morita , Akiko Matsui , Mitsuhiko Sugane , Takahide Mukouyama
IPC: H05K1/11
CPC classification number: H05K1/025 , H05K1/024 , H05K1/0248 , H05K1/0366 , H05K3/0052 , H05K2201/029
Abstract: A printed board includes an insulating body that has a flat surface and includes insulating cloth including first fibers and second fibers that cross the first fibers at right angles on the flat surface, and printed wiring including a plurality of signal lines that run parallel to each other and are laid out on the flat surface of the insulating body so that a direction of the signal lines is tilted to a direction of the first or second fibers at an angle which is determined based on board-cutting efficiency of the insulating body and a predetermined delay-time difference between the signal lines.
Abstract translation: 印刷电路板包括具有平坦表面的绝缘体，并且包括绝缘布，其包括第一纤维和第二纤维，所述第一纤维和第二纤维在平坦表面上与第一纤维成直角交叉;以及印刷布线，包括彼此平行延伸的多条信号线 并且布置在绝缘体的平坦表面上，使得信号线的方向以基于绝缘体的板切割效率确定的角度和预定的绝缘体的角度倾斜到第一或第二纤维的方向 信号线之间的延迟时间差。
-
-
-
-
-
-
-
-
-
Search Results
20
records
(took 0.015 seconds)
