公开(公告)号：US20030153671A1

公开(公告)日：2003-08-14

申请号：US10075203

申请日：2002-02-14

Applicant: The Glidden Company

Inventor： Glen Kaszubski ,  John A. Paul ,  Mark Stypczynski ,  Leo August Tischer

IPC: C08K003/34 ,  B65B001/00

CPC classification number: C09J201/10 ,  C08G65/336 ,  C09J171/02 ,  Y10T156/10

Abstract: The present invention relates to an adhesive and more particularly to a moisture curable adhesive. In one embodiment, the present invention includes a moisture curable adhesive comprising a polymer or copolymer including reactive silicon end groups; from about 0.01 to about 40 percent by weight of a clear filler that will not substantially interfere with the clarity of the adhesive; and from about 0.01 to about 10 percent by weight of a dehydrating agent. In another embodiment, the present invention includes a moisture curable adhesive comprising a copolymer including a reactive silicon group; from about 33 to about 85 percent by weight of a filler; and from about 0.01 to about 10 percent by weight of a dehydrating agent. The present invention is further directed to a method of joining two adherends.

Abstract translation: 本发明涉及一种粘合剂，更具体地说涉及一种可湿固化的粘合剂。 在一个实施方案中，本发明包括含有包含反应性硅端基的聚合物或共聚物的湿气固化粘合剂; 约0.01至约40重量％的透明填料，其基本上不会干扰粘合剂的透明度; 和约0.01至约10重量％的脱水剂。 在另一个实施方案中，本发明包括包含包含反应性硅基团的共聚物的湿气固化粘合剂; 约33至约85重量％的填料; 和约0.01至约10重量％的脱水剂。 本发明还涉及一种连接两个被粘物的方法。