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公开(公告)号:US06991470B2
公开(公告)日:2006-01-31
申请号:US10912146
申请日:2004-08-06
Applicant: Thomas Muench
Inventor: Thomas Muench
IPC: H01R12/00
CPC classification number: H01L24/05 , H01L23/057 , H01L23/49811 , H01L23/49827 , H01L23/50 , H01L23/5389 , H01L24/48 , H01L24/49 , H01L25/0655 , H01L2224/0401 , H01L2224/04042 , H01L2224/05554 , H01L2224/05556 , H01L2224/05599 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/16225 , H01L2224/18 , H01L2224/32225 , H01L2224/45099 , H01L2224/48091 , H01L2224/48095 , H01L2224/48137 , H01L2224/48227 , H01L2224/48228 , H01L2224/48471 , H01L2224/48479 , H01L2224/49109 , H01L2224/49113 , H01L2224/49171 , H01L2224/49175 , H01L2224/73204 , H01L2224/73265 , H01L2224/85051 , H01L2224/85186 , H01L2224/85399 , H01L2224/85424 , H01L2224/85439 , H01L2224/85444 , H01L2224/85447 , H01L2224/85986 , H01L2924/00014 , H01L2924/01004 , H01L2924/01006 , H01L2924/0101 , H01L2924/01013 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01047 , H01L2924/01052 , H01L2924/01055 , H01L2924/01058 , H01L2924/01061 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01088 , H01L2924/014 , H01L2924/10161 , H01L2924/12041 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30107 , H05K1/113 , H05K1/117 , H05K1/185 , H05K3/4623 , H05K2201/0355 , H05K2201/0394 , H05K2201/09154 , H05K2201/09472 , H05K2201/09536 , H05K2203/049 , H05K2203/1461 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207 , H01L2224/4554
Abstract: The invention relates to a circuit carrier and a method for producing it, the circuit carrier having a substrate with two oppositely arranged areas. The terminal contacts of a flat connector strip are arranged in the edge regions of the areas. A through contact is arranged under at least one of the terminal contacts with concealed electrical connection to the rear side of the terminal contact and the top side of the terminal contact exhibits an undisturbed morphology and planar surface.
Abstract translation: 电路载体及其制造方法技术领域本发明涉及一种电路载体及其制造方法,该电路载体具有基板,具有两个相对布置的区域。 扁平连接器条的端子触点布置在区域的边缘区域中。 在至少一个端子触点之下布置有一个贯通触点,其中,与端子触点的后侧具有隐蔽的电连接,并且端子触点的顶侧呈现出不受干扰的形态和平坦表面。
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公开(公告)号:US08580324B2
公开(公告)日:2013-11-12
申请号:US13132978
申请日:2009-12-11
Applicant: Eva Christina Maria Binggeli , Thomas Muench
Inventor: Eva Christina Maria Binggeli , Thomas Muench
IPC: A23L1/221
Abstract: Provided is a fermentation process wherein green ripe uncured vanilla beans are incubated with bacillus subtilis in isolated form to convert glucovanillin to vanillin while consistently forming a fully developed well-balanced vanilla aroma without off-notes.
Abstract translation: 提供了一种发酵方法,其中将绿色成熟未固化的香草豆与分离形式的枯草芽孢杆菌一起温育以将葡萄糖醛酸转化为香草醛,同时一致地形成完全发育良好平衡的香草香气而不脱落。
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公开(公告)号:US20060084285A1
公开(公告)日:2006-04-20
申请号:US11292082
申请日:2005-12-02
Applicant: Thomas Muench
Inventor: Thomas Muench
IPC: H01R12/00
CPC classification number: H01L24/05 , H01L23/057 , H01L23/49811 , H01L23/49827 , H01L23/50 , H01L23/5389 , H01L24/48 , H01L24/49 , H01L25/0655 , H01L2224/0401 , H01L2224/04042 , H01L2224/05554 , H01L2224/05556 , H01L2224/05599 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/16225 , H01L2224/18 , H01L2224/32225 , H01L2224/45099 , H01L2224/48091 , H01L2224/48095 , H01L2224/48137 , H01L2224/48227 , H01L2224/48228 , H01L2224/48471 , H01L2224/48479 , H01L2224/49109 , H01L2224/49113 , H01L2224/49171 , H01L2224/49175 , H01L2224/73204 , H01L2224/73265 , H01L2224/85051 , H01L2224/85186 , H01L2224/85399 , H01L2224/85424 , H01L2224/85439 , H01L2224/85444 , H01L2224/85447 , H01L2224/85986 , H01L2924/00014 , H01L2924/01004 , H01L2924/01006 , H01L2924/0101 , H01L2924/01013 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01047 , H01L2924/01052 , H01L2924/01055 , H01L2924/01058 , H01L2924/01061 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01088 , H01L2924/014 , H01L2924/10161 , H01L2924/12041 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30107 , H05K1/113 , H05K1/117 , H05K1/185 , H05K3/4623 , H05K2201/0355 , H05K2201/0394 , H05K2201/09154 , H05K2201/09472 , H05K2201/09536 , H05K2203/049 , H05K2203/1461 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207 , H01L2224/4554
Abstract: A circuit carrier includes a substrate with two oppositely arranged areas. The terminal contacts of a flat connector strip are arranged in the edge regions of the areas. A through contact is arranged under at least one of the terminal contacts with concealed electrical connection to the rear side of the terminal contact and the top side of the terminal contact exhibits an undisturbed morphology and planar surface.
Abstract translation: 电路载体包括具有两个相对布置区域的衬底。 扁平连接器条的端子触点布置在区域的边缘区域中。 在至少一个端子触点之下布置有一个贯通触点,其中,与端子触点的后侧具有隐蔽的电连接,并且端子触点的顶侧呈现出不受干扰的形态和平坦表面。
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公开(公告)号:US20050064732A1
公开(公告)日:2005-03-24
申请号:US10912146
申请日:2004-08-06
Applicant: Thomas Muench
Inventor: Thomas Muench
IPC: H01L23/057 , H01L23/498 , H01L23/50 , H01L23/538 , H01L25/065 , H05K1/11 , H05K1/18 , H05K3/46 , H01R12/00
CPC classification number: H01L24/05 , H01L23/057 , H01L23/49811 , H01L23/49827 , H01L23/50 , H01L23/5389 , H01L24/48 , H01L24/49 , H01L25/0655 , H01L2224/0401 , H01L2224/04042 , H01L2224/05554 , H01L2224/05556 , H01L2224/05599 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/16225 , H01L2224/18 , H01L2224/32225 , H01L2224/45099 , H01L2224/48091 , H01L2224/48095 , H01L2224/48137 , H01L2224/48227 , H01L2224/48228 , H01L2224/48471 , H01L2224/48479 , H01L2224/49109 , H01L2224/49113 , H01L2224/49171 , H01L2224/49175 , H01L2224/73204 , H01L2224/73265 , H01L2224/85051 , H01L2224/85186 , H01L2224/85399 , H01L2224/85424 , H01L2224/85439 , H01L2224/85444 , H01L2224/85447 , H01L2224/85986 , H01L2924/00014 , H01L2924/01004 , H01L2924/01006 , H01L2924/0101 , H01L2924/01013 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01047 , H01L2924/01052 , H01L2924/01055 , H01L2924/01058 , H01L2924/01061 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01088 , H01L2924/014 , H01L2924/10161 , H01L2924/12041 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30107 , H05K1/113 , H05K1/117 , H05K1/185 , H05K3/4623 , H05K2201/0355 , H05K2201/0394 , H05K2201/09154 , H05K2201/09472 , H05K2201/09536 , H05K2203/049 , H05K2203/1461 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207 , H01L2224/4554
Abstract: The invention relates to a circuit carrier and a method for producing it, the circuit carrier having a substrate with two oppositely arranged areas. The terminal contacts of a flat connector strip are arranged in the edge regions of the areas. A through contact is arranged under at least one of the terminal contacts with concealed electrical connection to the rear side of the terminal contact and the top side of the terminal contact exhibits an undisturbed morphology and planar surface.
Abstract translation: 电路载体及其制造方法技术领域本发明涉及一种电路载体及其制造方法,该电路载体具有基板,具有两个相对布置的区域。 扁平连接器条的端子触点布置在区域的边缘区域中。 在至少一个端子触点之下布置有一个贯通触点,其中,与端子触点的后侧具有隐蔽的电连接,并且端子触点的顶侧呈现出不受干扰的形态和平坦表面。
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公开(公告)号:US20110262593A1
公开(公告)日:2011-10-27
申请号:US13132978
申请日:2009-12-11
Applicant: Eva Christina Maria Binggeli , Thomas Muench
Inventor: Eva Christina Maria Binggeli , Thomas Muench
Abstract: Provided is a fermentation process wherein green ripe uncured vanilla beans are incubated with [microbes] bacillus subtilis in isolated form to convert glucovanillin to vanillin while consistently forming a fully developed well-balanced vanilla aroma without off-notes.
Abstract translation: 提供了一种发酵方法,其中将绿色成熟未固化的香草豆与分离形式的枯草芽孢杆菌一起温育以将葡萄糖醛酸转化为香草醛,同时始终形成完全发育良好平衡的香草香气而不含纸屑。
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公开(公告)号:US07153143B2
公开(公告)日:2006-12-26
申请号:US11292082
申请日:2005-12-02
Applicant: Thomas Muench
Inventor: Thomas Muench
IPC: H01R12/00
CPC classification number: H01L24/05 , H01L23/057 , H01L23/49811 , H01L23/49827 , H01L23/50 , H01L23/5389 , H01L24/48 , H01L24/49 , H01L25/0655 , H01L2224/0401 , H01L2224/04042 , H01L2224/05554 , H01L2224/05556 , H01L2224/05599 , H01L2224/05624 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/16225 , H01L2224/18 , H01L2224/32225 , H01L2224/45099 , H01L2224/48091 , H01L2224/48095 , H01L2224/48137 , H01L2224/48227 , H01L2224/48228 , H01L2224/48471 , H01L2224/48479 , H01L2224/49109 , H01L2224/49113 , H01L2224/49171 , H01L2224/49175 , H01L2224/73204 , H01L2224/73265 , H01L2224/85051 , H01L2224/85186 , H01L2224/85399 , H01L2224/85424 , H01L2224/85439 , H01L2224/85444 , H01L2224/85447 , H01L2224/85986 , H01L2924/00014 , H01L2924/01004 , H01L2924/01006 , H01L2924/0101 , H01L2924/01013 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01047 , H01L2924/01052 , H01L2924/01055 , H01L2924/01058 , H01L2924/01061 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01088 , H01L2924/014 , H01L2924/10161 , H01L2924/12041 , H01L2924/12042 , H01L2924/14 , H01L2924/181 , H01L2924/19041 , H01L2924/19042 , H01L2924/19043 , H01L2924/30107 , H05K1/113 , H05K1/117 , H05K1/185 , H05K3/4623 , H05K2201/0355 , H05K2201/0394 , H05K2201/09154 , H05K2201/09472 , H05K2201/09536 , H05K2203/049 , H05K2203/1461 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207 , H01L2224/4554
Abstract: A circuit carrier includes a substrate with two oppositely arranged areas. The terminal contacts of a flat connector strip are arranged in the edge regions of the areas. A through contact is arranged under at least one of the terminal contacts with concealed electrical connection to the rear side of the terminal contact and the top side of the terminal contact exhibits an undisturbed morphology and planar surface.
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公开(公告)号:USD474473S1
公开(公告)日:2003-05-13
申请号:US29155827
申请日:2002-02-19
Applicant: Jürgen Fischer , Harald Gundlach , Thomas Muench
Designer: Jürgen Fischer , Harald Gundlach , Thomas Muench
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