公开(公告)号：US20240282983A1

公开(公告)日：2024-08-22

申请号：US18560838

申请日：2022-05-09

Applicant: ThreeBond Co., Ltd.

Inventor： Yoshihide ARAI ,  Masayuki TANAKA ,  Nao SUZUKI ,  Hajime KIBE ,  Keisuke MINODA ,  Takuma KADO

IPC: H01M8/0286 ,  F16J15/10 ,  H01M8/0284

CPC classification number: H01M8/0286 ,  F16J15/108 ,  H01M8/0284

Abstract: According to one embodiment, a gasket molding method for molding a gasket on a workpiece includes, in the order recited: an application step for applying an active energy ray curable liquid into a cavity of a molding die; a bonding step for bonding the molding die coated with the active energy ray curable liquid and the workpiece; a curing step for curing the applied active energy ray curable liquid by irradiation with an active energy ray; and a mold release step for pulling off the cured active energy ray curable liquid from the molding die together with the workpiece.