公开(公告)号：US07722446B2

公开(公告)日：2010-05-25

申请号：US11533609

申请日：2006-10-17

Applicant: Timothy C Krywanczyk ,  Edmund J Sprogis

Inventor： Timothy C Krywanczyk ,  Edmund J Sprogis

IPC: B24B55/04

CPC classification number: H01L21/78

Abstract: In accordance with the foregoing objects and advantages, the present invention provides a fabrication device that may be used during the grinding operation of the fabrication process. The fabrication device comprises a socket plate that includes a plurality of cavities formed therein that correspond in position and number to the solder (or other conductive material) bumps formed on the front surface of a product wafer.

Abstract translation: 根据上述目的和优点，本发明提供了可在制造过程的磨削操作期间使用的制造装置。 该制造装置包括插座板，该插座板包括形成在其中的多个空腔，其位置和数量与形成在产品晶片的前表面上的焊料（或其它导电材料）凸起相对应。

公开(公告)号：US08230586B2

公开(公告)日：2012-07-31

申请号：US11848263

申请日：2007-08-31

Applicant: Douglas D Coolbaugh ,  Ebenezer E Eshun ,  Terence B Hook ,  Robert M Rassel ,  Edmund J Sprogis ,  Anthony K Stamper ,  William J Murphy

Inventor： Douglas D Coolbaugh ,  Ebenezer E Eshun ,  Terence B Hook ,  Robert M Rassel ,  Edmund J Sprogis ,  Anthony K Stamper ,  William J Murphy

IPC: H01C7/02 ,  H01C7/04

CPC classification number: H01C7/1013 ,  H01C1/084 ,  H01L2924/0002 ,  Y10T29/49083 ,  Y10T29/49085 ,  Y10T29/49099 ,  Y10T29/49144 ,  Y10T29/49147 ,  H01L2924/00

Abstract: A method of cooling a resistor is provided. The method includes forming a first electrical insulator having a high thermal conductivity in thermal contact with an electrically resistive pathway and forming a substrate adjacent the electrical insulator. The method further includes forming a first electrical conductor having a high thermal conductivity within the second substrate and in thermal contact with the electrical insulator.

Abstract translation: 提供一种冷却电阻器的方法。 该方法包括形成具有与电阻通路热接触的高热导率的第一电绝缘体，并形成邻近电绝缘体的衬底。 该方法还包括在第二衬底内形成具有高导热性并与电绝缘体热接触的第一电导体。