公开(公告)号：US5830800A

公开(公告)日：1998-11-03

申请号：US839395

申请日：1997-04-11

Applicant: Ting-hao Lin

Inventor： Ting-hao Lin

IPC: H01L21/56 ,  H01L21/68 ,  H01L23/31 ,  H01L21/30 ,  H01L21/46

CPC classification number: H01L21/568 ,  H01L21/561 ,  H01L23/3128 ,  H01L24/97 ,  H01L2221/68345 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/85001 ,  H01L2224/97 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  Y10S438/977

Abstract: A packaging method for a ball grid array (BGA) integrated circuit (IC) without utilizing a base plate as a supporting plate, and therefore reducing the thickness of the packaged BGA IC. In the method, a copper sheet is used as a supporting plate first. After resin is applied to coat a chip implanted on the copper sheet and connecting wires thereof has hardened, the hardened resin is sufficiently firm to support the IC, so the copper sheet can be etched. Accordingly, a base plate is not necessary.

Abstract translation: 一种用于球栅阵列（BGA）集成电路（IC）的封装方法，不使用基板作为支撑板，因此减小了封装的BGA IC的厚度。 在该方法中，首先使用铜片作为支撑板。 施加树脂涂布在铜片上的芯片并且其连接线已经硬化时，硬化树脂足够坚固以支撑IC，因此可以蚀刻铜片。 因此，不需要基板。

公开(公告)号：US5884396A

公开(公告)日：1999-03-23

申请号：US846857

申请日：1997-05-01

Applicant: Ting-hao Lin

Inventor： Ting-hao Lin

IPC: H01L23/31 ,  H05K3/20 ,  H01R43/00

CPC classification number: H01L23/3128 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2924/15311 ,  H05K3/20 ,  Y10T29/49121

Abstract: The present invention relates to a TF-BGA method for manufacturing a packaging substrate, and includes steps of forming a single-sided circuit on a copper plate by electroplating, removing a layer of photoresist and sequentially laminating a dielectric layer and a metal plate on the copper plate, etching the copper plate, selectively applying a layer of solder resist, defining a cavity opening by punching, routing or etching, attaching a heat sink, forming dam rings and protecting the laminate by mold compound, attaching a die and bonding gold wires and encapsulating the cavity opening by encapsulate and attaching solder balls. In particular, a metal plate substitutes for a BT resin material to achieve low packaging cost and increasing the heat dissipating efficiency. A transfer flat type ball grid array method is employed to achieve an effect of fine circuitry and each single substrate is processed and tested individually. After the defective substrate units have been removed, the substrate units proved to be good are arranged in a long strip form and the borders thereof are molded to link in a latitudinal extension shape. A problem of the conventional entire strip of substrate set becoming useless when part of the substrate units are defective can be eliminated.

Abstract translation: 本发明涉及一种用于制造封装衬底的TF-BGA方法，包括以下步骤：通过电镀在铜板上形成单面电路，除去一层光致抗蚀剂，并依次层叠电介质层和金属板 铜板，蚀刻铜板，选择性地施加一层阻焊剂，通过冲压，布线或蚀刻，安装散热片，形成阻挡环并通过模塑化合物保护层压板，连接芯片和接合金线来限定空腔开口 并通过封装并附着焊球来封装空腔开口。 特别地，金属板代替BT树脂材料以实现低封装成本并增加散热效率。 采用转移平板式球栅阵列方法来实现精细电路的效果，并且单个基板被单独处理和测试。 在已经去除了有缺陷的基板单元之后，证明为良好的基板单元被布置成长条形，并且其边界被模制成以横向延伸形状连接。 可以消除当基板单元的一部分有缺陷时传统的整个基板组件变得无用的问题。

公开(公告)号：US5882957A

公开(公告)日：1999-03-16

申请号：US871471

申请日：1997-06-09

Applicant: Ting-hao Lin

Inventor： Ting-hao Lin

IPC: H01L21/48 ,  H01L23/24 ,  H01L23/31 ,  H01L23/36 ,  H01L23/498 ,  H05K3/20 ,  H01L21/44 ,  H01L21/50

CPC classification number: H01L23/49816 ,  H01L21/4853 ,  H01L21/4857 ,  H01L23/24 ,  H01L23/36 ,  H01L2221/68345 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/92247 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/01028 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/3025 ,  H05K3/20

Abstract: A BGA packaging method for an IC includes steps of providing a first dry film to a copper plate, plating nickel-copper to form circuits on one side of the copper plate, providing a second dry film, selectively plating nickel-gold, removing the dry films, providing an insulating layer, providing a back plate, attaching a chip, wire bonding, encapsulating the chip and wires with plastic, etching copper, providing solder resist and attaching solder balls. By this method, a packaged IC with excellent electrical characteristics and heat dissipation can be obtained through a simple procedure.

Abstract translation: 用于IC的BGA封装方法包括以下步骤：向铜板提供第一干膜，镀镍铜以在铜板的一侧上形成电路，提供第二干膜，选择性镀镍金，去除干 膜，提供绝缘层，提供背板，附接芯片，引线接合，用塑料封装芯片和电线，蚀刻铜，提供阻焊剂和附接焊球。 通过这种方法，可以通过简单的程序获得具有优异的电特性和散热的封装IC。