公开(公告)号：US20130142886A1

公开(公告)日：2013-06-06

申请号：US13814525

申请日：2011-08-03

Applicant: Freddie L. Singleton ,  Tirthankar Ghosh ,  Kimberly S. Cagle

Inventor： Freddie L. Singleton ,  Tirthankar Ghosh ,  Kimberly S. Cagle

IPC: A01N37/18 ,  A01N59/20 ,  A01N59/16

CPC classification number: A01N37/18 ,  A01N37/30 ,  A01N59/00 ,  A01N59/20 ,  C02F1/50 ,  C02F2103/023 ,  C02F2303/08 ,  A01N59/16 ,  A01N2300/00

Abstract: A biocidal composition comprising 2,2-dibromomalonamide and a metal selected from silver, copper, and mixtures thereof, and its use for the control of microorganisms in aqueous and water-containing systems.

Abstract translation: 包含2,2-二溴马来酰亚胺和选自银，铜及其混合物的金属的杀生物组合物及其在含水和含水体系中控制微生物的用途。

公开(公告)号：US20100081729A1

公开(公告)日：2010-04-01

申请号：US12584324

申请日：2009-09-03

Applicant: Jennifer Reichl Collin ,  Tirthankar Ghosh ,  Fanwen Zeng

Inventor： Jennifer Reichl Collin ,  Tirthankar Ghosh ,  Fanwen Zeng

IPC: C09D5/16 ,  B05D3/00

CPC classification number: C09D5/14

Abstract: There is provided a coating composition comprising (a) one or more microbicide, (b) one or more soluble polymer comprising, as polymerized units, one or more monomer with one or more pendant heterocycle, wherein said heterocycle has one or more hetero atom selected from the group consisting of N, O, S, and combinations thereof, and wherein said polymer has no anionic groups, and (c) solvent, wherein said polymer is dissolved in said solvent; wherein said composition contains no polymeric biguanide; and wherein 50% or more of said microbicide, by weight based on the total weight of microbicide, is not covalently bonded to any polymer.

Abstract translation: 提供一种涂料组合物，其包含（a）一种或多种杀微生物剂，（b）一种或多种可溶性聚合物，其包含作为聚合单元的一种或多种单体与一种或多种侧挂杂环，其中所述杂环具有一个或多个选择的杂原子 来自由N，O，S及其组合组成的组，并且其中所述聚合物不具有阴离子基团，和（c）溶剂，其中所述聚合物溶于所述溶剂中; 其中所述组合物不含聚合双胍; 并且其中基于杀微生物剂的总重量计，所述杀微生物剂的50重量％以上并不共价键合到任何聚合物上。

公开(公告)号：US20090137747A1

公开(公告)日：2009-05-28

申请号：US12313963

申请日：2008-11-26

Applicant: Tirthankar Ghosh ,  Joseph Martin Rokowski ,  Morris Christopher Wills

Inventor： Tirthankar Ghosh ,  Joseph Martin Rokowski ,  Morris Christopher Wills

IPC: C08G73/00

CPC classification number: C08F2/22 ,  C08F26/06 ,  C09D4/00

Abstract: An aqueous composition comprising polymer particles of one or more aqueous emulsion copolymer and a homopolymer comprising polymerized units derived from monomer X, wherein monomer X is selected from polymerizable derivatives of imidazole, imidazoline, amidine, pyridine, pyrrole, pyrrolidine, pyrrolidinone, caprolactam, and combinations thereof. Also disclosed are methods of making and using the compositions.

Abstract translation: 一种水性组合物，其包含一种或多种水性乳液共聚物的聚合物颗粒和包含衍生自单体X的聚合单元的均聚物，其中单体X选自咪唑，咪唑啉，脒，吡啶，吡咯，吡咯烷，吡咯烷酮，己内酰胺和 其组合。 还公开了制备和使用组合物的方法。

公开(公告)号：US20050226914A1

公开(公告)日：2005-10-13

申请号：US11082667

申请日：2005-03-17

Applicant: Stephanie Cottrell ,  Tirthankar Ghosh ,  Barry Weinstein

Inventor： Stephanie Cottrell ,  Tirthankar Ghosh ,  Barry Weinstein

IPC: D06M15/263 ,  A01N25/34 ,  A01N43/36 ,  A01N43/50 ,  A01N59/16 ,  A61K9/70 ,  D06M11/83 ,  D06M13/50 ,  D06M15/00 ,  D06M15/21 ,  D06M15/356

CPC classification number: A01N59/16 ,  Y10T442/2525 ,  Y10T442/277 ,  Y10T442/2861 ,  Y10T442/60 ,  A01N43/50 ,  A01N25/34 ,  A01N25/10 ,  A01N2300/00

Abstract: Treated fiber substrates and methods of making and using the same are disclosed. The disclosed treated fiber substrates provide persistent, durable, broad spectrum, antimicrobial activity. The treated fiber substrates may be used in a variety of materials to impart antimicrobial activity thereto.

Abstract translation: 公开了处理的纤维基材及其制备和使用方法。 所公开的经处理的纤维底物提供持久的，持久的，广谱的抗微生物活性。 经处理的纤维基材可以用于各种材料以赋予其抗微生物活性。

公开(公告)号：US5756005A

公开(公告)日：1998-05-26

申请号：US731228

申请日：1996-10-11

Applicant: Tirthankar Ghosh ,  John Robert Mattox

Inventor： Tirthankar Ghosh ,  John Robert Mattox

IPC: C07D275/02 ,  A01N43/80 ,  C07B63/00 ,  C09K15/02 ,  C10M135/36 ,  C10M173/02 ,  C09K15/16

CPC classification number: C10M173/02 ,  A01N43/80 ,  C09K15/02 ,  C10M135/36 ,  C10M2201/02 ,  C10M2201/08 ,  C10M2201/081 ,  C10M2201/082 ,  C10M2201/084 ,  C10M2207/022 ,  C10M2207/023 ,  C10M2219/10 ,  C10M2219/102 ,  C10M2219/104 ,  C10M2219/106 ,  C10M2219/108 ,  C10N2240/401 ,  C10N2250/02

Abstract: The present invention provides a method of stabilizing non-halogenated 3-isothiazolones in aggressive systems with pH above 8.5. The invention also discloses compositions with pH above 8.5, containing non-halogenated 3-isothiazolones and an effective stabilizing amount of a iodine-containing stabilizer.

Abstract translation: 本发明提供一种在pH高于8.5的侵蚀性体系中稳定非卤化3-异噻唑酮的方法。 本发明还公开了pH8.5以上的组合物，其含有非卤化的3-异噻唑酮和有效稳定量的含碘稳定剂。

公开(公告)号：US5725806A

公开(公告)日：1998-03-10

申请号：US747102

申请日：1996-11-08

Applicant: Tirthankar Ghosh

Inventor： Tirthankar Ghosh

IPC: A01N25/22 ,  A01N43/80 ,  C07D275/02 ,  C07D275/03 ,  C07D277/14

CPC classification number: A01N43/80 ,  C07D275/03

Abstract: A method of stabilizing non-halogen containing 3-isothiazolone microbicides against chemical degradation by the introduction of aromatic disulfide compounds (except 2,2'-dithiobisbenzoic acid) is disclosed.

Abstract translation: 公开了一种通过引入芳族二硫化物化合物（2,2'-二硫代双苯甲酸除外）稳定含有3-异噻唑酮杀微生物剂的化学降解的不含卤素的方法。

公开(公告)号：US07968619B2

公开(公告)日：2011-06-28

申请号：US12713751

申请日：2010-02-26

Applicant: Stephanie Nussbaum Cottrell ,  Tirthankar Ghosh

Inventor： Stephanie Nussbaum Cottrell ,  Tirthankar Ghosh

IPC: C08G79/00 ,  C08L85/00 ,  C09D5/16 ,  D06M13/224

CPC classification number: D06M15/21 ,  A01N59/16 ,  D06M15/507 ,  D06M15/55 ,  D06M15/564 ,  D06M15/568 ,  D06M15/572 ,  D06M16/00 ,  A01N25/10 ,  A01N2300/00

Abstract: A composition useful for treating fabrics. The composition contains a silver-containing copolymer having polymerized units of a monomer X and a monomer Y; wherein monomer X is an ethylenically unsaturated compound having a substituent group selected from an unsaturated or aromatic heterocyclic group having at least one nitrogen atom; wherein monomer Y is selected from carboxylic acids, carboxylic acid salts, carboxylic acid esters, organosulfuric acids, organosulfuric acid salts, sulfonic acids, sulfonic acid salts, phosphonic acids, phosphonic acid salts, vinyl esters, (meth)acrylamides, C8-C20 aromatic monomers containing at least one exocyclic ethylenic unsaturation and combinations thereof.

Abstract translation: 用于处理织物的组合物。 该组合物含有具有单体X和单体Y的聚合单元的含银共聚物; 其中单体X是具有选自具有至少一个氮原子的不饱和或芳族杂环基的取代基的烯属不饱和化合物; 其中单体Y选自羧酸，羧酸盐，羧酸酯，有机硫酸，有机硫酸盐，磺酸，磺酸盐，膦酸，膦酸盐，乙烯基酯，（甲基）丙烯酰胺，C 8 -C 20芳族 含有至少一个环外烯属不饱和基团的单体及其组合。

公开(公告)号：US07435356B2

公开(公告)日：2008-10-14

申请号：US10996689

申请日：2004-11-24

Applicant: Tirthankar Ghosh ,  Robert D. Solomon ,  Hongyu Wang

Inventor： Tirthankar Ghosh ,  Robert D. Solomon ,  Hongyu Wang

IPC: C09K13/00

CPC classification number: H01L21/7684 ,  C09G1/04

Abstract: An aqueous abrasive-free composition is useful for chemical mechanical polishing of a patterned semiconductor wafer containing a nonferrous metal. The composition comprises an oxidizer, an inhibitor for the nonferrous metal, 0 to 15 weight percent water soluble modified cellulose, 0 to 15 weight percent phosphorus compound, 0.005 to 5 weight percent of an amphiphilic polymer, the amphiphilic polymer having an ionic hydrophilic portion with a carbon number of 2 to 250 and water.

Abstract translation: 无水磨料组合物可用于含有有色金属的图案化半导体晶片的化学机械抛光。 该组合物包含氧化剂，有色金属抑制剂，0-15重量％水溶性改性纤维素，0-15重量％磷化合物，0.005-5重量％两亲聚合物，两性聚合物具有离子亲水部分与 碳数为2至250和水。

公开(公告)号：US20080115291A1

公开(公告)日：2008-05-22

申请号：US11978435

申请日：2007-10-29

Applicant: Stephanie Nussbaum Cottrell ,  Tirthankar Ghosh

Inventor： Stephanie Nussbaum Cottrell ,  Tirthankar Ghosh

IPC: C08L71/00

CPC classification number: D06M15/21 ,  A01N25/10 ,  D06M11/65 ,  D06M11/83 ,  D06M13/352 ,  D06M15/263 ,  D06M15/356 ,  D06M15/55 ,  D06M16/00 ,  A01N59/16 ,  A01N2300/00

Abstract: A composition useful for treating fabrics. The composition contains a silver-containing copolymer having polymerized units of a monomer X and a monomer Y; wherein monomer X is an ethylenically unsaturated compound having a substituent group selected from an unsaturated or aromatic heterocyclic group having at least one hetero atom selected from N, O and S; wherein monomer Y is selected from carboxylic acids, carboxylic acid salts, carboxylic acid esters, organosulfuric acids, organosulfuric acid salts, sulfonic acids, sulfonic acid salts, phosphonic acids, phosphonic acid salts, vinyl esters, (meth)acrylamides, C8-C20 aromatic monomers containing at least one exocyclic ethylenic unsaturation and combinations thereof.

Abstract translation: 用于处理织物的组合物。 该组合物含有具有单体X和单体Y的聚合单元的含银共聚物; 其中单体X是具有选自具有至少一个选自N，O和S的杂原子的不饱和或芳族杂环基的取代基的烯属不饱和化合物; 其中单体Y选自羧酸，羧酸盐，羧酸酯，有机硫酸，有机硫酸盐，磺酸，磺酸盐，膦酸，膦酸盐，乙烯基酯，（甲基）丙烯酰胺， 8个-C 20芳族单体，其含有至少一个环外烯属不饱和基团及其组合。

公开(公告)号：US06936541B2

公开(公告)日：2005-08-30

申请号：US10402168

申请日：2003-03-28

Applicant: Jinru Bian ,  Tirthankar Ghosh ,  Terence M. Thomas

Inventor： Jinru Bian ,  Tirthankar Ghosh ,  Terence M. Thomas

IPC: B24B37/005 ,  B24B37/04 ,  C09G1/00 ,  C09G1/02 ,  H01L21/321 ,  H01L21/302

CPC classification number: H01L21/3212 ,  B24B37/0056 ,  B24B37/044 ,  C09G1/00 ,  C09G1/02

Abstract: A method for planarizing metal interconnects of a semiconductor wafer includes the steps of polishing the semiconductor wafer with a polishing solution and a polishing pad to planarize the metal interconnects. The polishing solution has by weight percent, 0.15 to 5 benzotriazole, 0 to 1 abrasive, 0 to 10 polymeric particles, 0 to 5 polymer-coated particles and balance water at a pH of less than 5 and a removal rate-pressure sensitivity (dr/dp) of at least 750 (Å/min/psi). The polishing simultaneously accelerates removal of projecting metal from the metal interconnects with the polishing pad providing a first pressure that increases removal rate of the projecting metal; and it inhibits removal of recessed metal from the metal interconnects with the polishing pad providing a second pressure that decreases removal of the recessed metal.

Abstract translation: 用于平面化半导体晶片的金属互连的方法包括以下步骤：用抛光溶液和抛光垫对半导体晶片进行抛光，以平坦化金属互连。 抛光溶液的重量百分数为0.15至5苯并三唑，0至1份磨料，0至10种聚合物颗粒，0至5种聚合物涂覆的颗粒，并且在pH小于5的情况下平衡水和去除率 - 压力敏感度（d 至少750（Å/ min / psi）。 抛光同时加速从抛光垫从金属互连件移除突出的金属，提供提高突出金属的去除速率的第一压力; 并且其抑制了从抛光垫从金属互连件去除凹陷金属，从而提供减小凹陷金属去除的第二压力。