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    SOLUTION TREATMENT APPARATUS AND CLEANING METHOD
    3.
    发明申请
    SOLUTION TREATMENT APPARATUS AND CLEANING METHOD 有权

    公开(公告)号：US20220113643A1

    公开(公告)日：2022-04-14

    申请号：US17485698

    申请日：2021-09-27

    Applicant: Tokyo Electron Limited

    Inventor： Kenta SHIBASAKI ,  Hiroichi INADA ,  Satoshi SHIMMURA ,  Koji TAKAYANAGI ,  Kenji YADA ,  Shinichi SEKI ,  Akihiro TERAMOTO

    IPC: G03F7/20 ,  B08B3/08 ,  G03F7/16

    Abstract: A solution treatment apparatus for applying a coating solution onto a substrate, includes: a holder holding and rotating the substrate; a coating solution supplier supplying the coating solution to the substrate on the holder; and an inner cup surrounding the holder from a lateral side and having a peripheral edge side upper surface inclining down outward in a radial direction from an apex part located below a peripheral edge side of the substrate on the holder, wherein: the inner cup has a plurality of discharge ports formed along a circumferential direction at the apex part; and the discharge ports are formed to discharge a cleaning solution and make the cleaning solution flow down along the peripheral edge side upper surface of the inner cup, thereby cleaning the peripheral edge side upper surface, and to discharge the cleaning solution outward in the radial direction and obliquely upward.

    SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD
    4.
    发明申请
    SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD 有权
    基板处理装置和基板处理方法

    公开(公告)号：US20130211571A1

    公开(公告)日：2013-08-15

    申请号：US13759515

    申请日：2013-02-05

    Applicant: TOKYO ELECTRON LIMITED

    Inventor： Akihiro TERAMOTO ,  Tokutarou HAYASHI

    IPC: G05B19/418

    CPC classification number: G05B19/4189 ,  B25J9/1612 ,  G05B2219/39479 ,  G05B2219/39508

    Abstract: A technique which, when transporting a substrate from one module to another, detects a displacement of the substrate on a holding member and transfers the substrate to another module with the displacement within an acceptable range. Displacement of a wafer on a fork of a transport arm from a reference position is determined when the fork has received the wafer from one module and, when the displacement is within an acceptable range, the wafer is transported by the transport arm to another module. When the displacement is out of the acceptable range, the wafer is transported by the transport arm to a wafer stage module, and then the transport arm receives the wafer from the wafer stage module so that the displacement comes to fall within the acceptable range. The wafer can therefore be transferred to another module with the displacement within the acceptable range.

    Abstract translation: 一种将基板从一个模块传送到另一个模块的技术是检测基板在保持部件上的位移，并且将该基板转移到另一个位移在可接受范围内的模块。 当叉子从一个模块接收到晶片时，确定了从基准位置移动臂的叉子上的晶片的位移，并且当位移在可接受的范围内时，晶片被传送臂传送到另一个模块。 当位移超出可接受范围时，晶片由传送臂传送到晶片台模块，然后传输臂从晶片台模块接收晶片，使得位移落入可接受的范围内。 因此，晶片可以被转移到具有在可接受范围内的位移的另一个模块。

    SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD AND NON-TRANSITORY STORAGE MEDIUM
    5.
    发明申请
    SUBSTRATE PROCESSING APPARATUS, SUBSTRATE PROCESSING METHOD AND NON-TRANSITORY STORAGE MEDIUM 有权
    基板处理设备，基板处理方法和非接收式存储介质

    公开(公告)号：US20130202388A1

    公开(公告)日：2013-08-08

    申请号：US13759471

    申请日：2013-02-05

    Applicant: TOKYO ELECTRON LIMITED

    Inventor： Tokutarou HAYASHI ,  Yuichi DOUKI ,  Hirotoshi MORI ,  Akihiro TERAMOTO

    IPC: H01L21/677 ,  H01L21/673

    CPC classification number: H01L21/677 ,  H01L21/67178 ,  H01L21/67184 ,  H01L21/67259 ,  H01L21/67288 ,  H01L21/673 ,  H01L21/67742

    Abstract: There is provided a technique which can prevent poor processing of successive substrates in the event of a failure of a module or a transport mechanism for transporting a substrate between modules. A substrate processing apparatus includes: a plurality of modules from which a substrate holder of a substrate transport mechanism receives a substrate; a sensor section for detecting a displacement of the holding position of a substrate, held by the substrate holder, from a reference position preset in the substrate holder; and a storage section for storing the displacement, detected when the substrate holder receives a substrate from each of the modules, in a chronological manner for each module. A failure of one of the modules or the substrate transport mechanism is estimated based on the chronological data on the displacement for each module, stored in the storage section. This enables an early detection of a failure or abnormality.

    Abstract translation: 提供了一种技术，其可以防止在模块故障或用于在模块之间传送基板的输送机构的情况下连续的基板的加工不良。 基板处理装置包括：多个模块，基板传送机构的基板保持器从该多个模块接收基板; 传感器部分，用于检测由衬底保持器保持的衬底的保持位置从预设在衬底保持器中的参考位置的位移; 以及存储部，用于存储当基板保持器从每个模块接收到基板时检测到的位移，用于每个模块的按时间顺序排列。 基于存储在存储部中的每个模块的位移的时间顺序数据来估计模块或基板传送机构中的一个的故障。 这使得能够及早发现故障或异常。

    SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE PROCESSING METHOD
    7.
    发明公开
    SUBSTRATE PROCESSING SYSTEM AND SUBSTRATE PROCESSING METHOD 审中-公开

    公开(公告)号：US20240249964A1

    公开(公告)日：2024-07-25

    申请号：US18417564

    申请日：2024-01-19

    Applicant: Tokyo Electron Limited

    Inventor： Shinsuke TAKAKI ,  Seiji NAKASHIMA ,  Akihiro TERAMOTO ,  Ryo SHOBU

    IPC: H01L21/677 ,  H01L21/67 ,  H01L21/673

    CPC classification number: H01L21/67736 ,  H01L21/67161 ,  H01L21/67225 ,  H01L21/67389 ,  H01L21/6773

    Abstract: A substrate processing system that performs substrate processing includes: a first processing system having one of a wet processing apparatus and a dry processing apparatus; a second processing system having the other one of the wet processing apparatus and the dry processing apparatus, wherein the first processing system includes a common stage, which is common to the first processing system and the second processing system and is configured to place thereon a container accommodating substrates before being subjected to the substrate processing, wherein the substrate processing system further includes: a first transfer system configured to transfer the substrates between the first processing system and the second processing system; and a second transfer system connected to at least the second processing system, and configured to transfer the substrates between the first processing system and the second processing system, or between another stage and the second processing system.

    SOLUTION TREATMENT APPARATUS AND CLEANING METHOD
    8.
    发明公开
    SOLUTION TREATMENT APPARATUS AND CLEANING METHOD 审中-公开

    公开(公告)号：US20240085813A1

    公开(公告)日：2024-03-14

    申请号：US18515667

    申请日：2023-11-21

    Applicant: Tokyo Electron Limited

    Inventor： Kenta SHIBASAKI ,  Hiroichi INADA ,  Satoshi SHIMMURA ,  Koji TAKAYANAGI ,  Kenji YADA ,  Shinichi SEKI ,  Akihiro TERAMOTO

    IPC: G03F7/00 ,  B05C11/02 ,  B08B3/08 ,  G03F7/16

    CPC classification number: G03F7/70925 ,  B05C11/02 ,  B08B3/08 ,  G03F7/162

    Abstract: A cleaning method of cleaning a solution treatment apparatus for applying a coating solution onto a substrate, the solution treatment apparatus including a holder holding and rotating the substrate; a coating solution supplier; and an inner cup surrounding the holder from a lateral side and having a peripheral edge side upper surface inclining down outward in a radial direction. The cleaning method includes introducing the cleaning solution to the storage chamber via the introduction hole, discharging the cleaning solution from the discharge port and making the cleaning solution flow down along the peripheral edge side upper surface of the inner cup, thereby cleaning away the coating solution adhering to the peripheral edge side upper surface. The discharging in the cleaning discharges the cleaning solution from discharge ports of the inner cup outward in the radial direction and obliquely upward.

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