公开(公告)号：US20210247240A1

公开(公告)日：2021-08-12

申请号：US16789046

申请日：2020-02-12

Applicant: Tokyo Electron Limited

Inventor： Melvin Verbaas ,  Kentaro Asakura ,  Takashi Mochizuki ,  Takahisa Mase ,  Nobutaka Yoshioka ,  Saki Matsuo

IPC: G01K7/02 ,  G01K1/08 ,  H05B3/14 ,  H05B3/26 ,  H01L21/67

Abstract: Multi-point thermocouples and assemblies are disclosed for ceramic heating structures. The disclosed embodiments provide multi-point connections in distinct areas to provide good temperature-sensing contacts between metal thermocouples and ceramic bodies while also providing improved flexibility. As such, cracking of ceramic bodies for heating structures is avoided. For one embodiment, assemblies including a multi-point thermocouple and a ceramic body are used in bake plates for processing systems that process microelectronic workpieces. The metal thermocouple has a flat surface used for connections to the ceramic body. Preferably, the thermocouple is relatively thin and provides improved connection sites and flexibility.

公开(公告)号：US10221478B2

公开(公告)日：2019-03-05

申请号：US14787860

申请日：2014-02-10

Applicant: TOKYO ELECTRON LIMITED

Inventor： Kensaku Narushima ,  Daisuke Toriya ,  Kentaro Asakura ,  Seishi Murakami

IPC: H01L21/67 ,  H01J37/32 ,  C23C16/458 ,  C23C16/44 ,  H01L21/687 ,  C23C16/34 ,  C23C16/455

Abstract: A film formation device includes: a processing vessel; a mounting stand installed within the processing vessel and configured to mount a substrate thereon; an elevating shaft installed so as to extend in an up-down direction while supporting the mounting stand and connected to an external elevator mechanism through a through-hole formed in the processing vessel; a bellows installed between the processing vessel and the elevator mechanism and configured to cover a periphery of the elevating shaft at a lateral side of the elevating shaft; a lid member disposed so as to surround the elevating shaft with a gap left between a lateral circumferential surface of the elevating shaft and the lid member; and a purge gas supply part configured to supply a purge gas into the bellows so that a gas flow from the bellows toward the processing vessel through the gap is formed.

公开(公告)号：US12094753B2

公开(公告)日：2024-09-17

申请号：US17363401

申请日：2021-06-30

Applicant: Tokyo Electron Limited

Inventor： Melvin Verbaas ,  Einosuke Tsuda ,  Kentaro Asakura

IPC: H01L21/687 ,  H01J37/32 ,  H05B3/22

CPC classification number: H01L21/68742 ,  H05B3/22 ,  H01J37/32724 ,  H01J2237/20235

Abstract: A stage device includes: a stage having a pin hole provided therein and a placement surface on which a substrate is placed; and at least one lift pin configured to move up and down through the pin hole; and a lifter configured to raise and lower the at least one lift pin, wherein the stage includes a first heating part provided therein and configured to heat the stage, and the at least one lift pin includes a second heating part provided therein or therearound and configured to heat the at least one lift pin.

公开(公告)号：US11774298B2

公开(公告)日：2023-10-03

申请号：US16789046

申请日：2020-02-12

Applicant: Tokyo Electron Limited

Inventor： Melvin Verbaas ,  Kentaro Asakura ,  Takashi Mochizuki ,  Takahisa Mase ,  Nobutaka Yoshioka ,  Saki Matsuo

IPC: G01K7/02 ,  H05B3/26 ,  H05B3/14 ,  G01K1/08 ,  H01L21/67 ,  G01K1/14 ,  G01K1/16 ,  H01L21/687

CPC classification number: G01K7/02 ,  G01K1/08 ,  G01K1/14 ,  G01K1/16 ,  H01L21/67098 ,  H05B3/141 ,  H05B3/265 ,  H01L21/67103 ,  H01L21/68785

Abstract: Multi-point thermocouples and assemblies are disclosed for ceramic heating structures. The disclosed embodiments provide multi-point connections in distinct areas to provide good temperature-sensing contacts between metal thermocouples and ceramic bodies while also providing improved flexibility. As such, cracking of ceramic bodies for heating structures is avoided. For one embodiment, assemblies including a multi-point thermocouple and a ceramic body are used in bake plates for processing systems that process microelectronic workpieces. The metal thermocouple has a flat surface used for connections to the ceramic body. Preferably, the thermocouple is relatively thin and provides improved connection sites and flexibility.

公开(公告)号：US11664266B2

公开(公告)日：2023-05-30

申请号：US16915046

申请日：2020-06-29

Applicant: Tokyo Electron Limited

Inventor： Yuichiro Wagatsuma ,  Kentaro Asakura ,  Tetsuya Saitou ,  Masahisa Watanabe

IPC: H01L21/68 ,  H01L21/687 ,  H01L21/67 ,  H01L21/677

CPC classification number: H01L21/68742 ,  H01L21/67098 ,  H01L21/67751

Abstract: A substrate processing apparatus includes: a stage for performing at least one of heating and cooling on a substrate placed thereon and having a through-hole vertically penetrating the stage; a substrate support pin having an insertion portion inserted into the through-hole and configured so that the insertion portion protrudes from an upper surface of the stage through the through-hole; and a pin support member for supporting the substrate support pin. The substrate support pin has a flange portion located below a lower surface of the stage. The support member supports the substrate support pin by engagement with the flange portion. The through-hole is smaller than the flange portion. The substrate support pin includes a first member including the flange portion and a second member having the insertion portion. The first member has a sliding surface which slidably supports the second member.