公开(公告)号：US20230055853A1

公开(公告)日：2023-02-23

申请号：US17820299

申请日：2022-08-17

Applicant: Tokyo Electron Limited

Inventor： Takashi Terada ,  Yuji Mimura ,  Hiroshi Maeda ,  Kazutaka Noda ,  Masaru Honda ,  Ryoichi Sakamoto ,  Yutaka Yamasaki ,  Tatsuya Kitayama ,  Akira Fukutomi

IPC: B32B43/00

Abstract: A separating method includes holding a combined substrate and separating a first substrate. In the holding of the combined substrate, the combined substrate in which the first substrate and a second substrate are bonded is held. In the separating of the first substrate, the first substrate is separated from the combined substrate, starting from a side surface of the combined substrate. The separating of the first substrate includes brining a fluid containing water into contact with the side surface.

公开(公告)号：US20220277979A1

公开(公告)日：2022-09-01

申请号：US17594973

申请日：2020-04-27

Applicant: Tokyo Electron Limited

Inventor： Yutaka Yamasaki ,  Takashi Terada

IPC: H01L21/68 ,  H01L21/18 ,  H01L21/687 ,  H01L21/683

Abstract: A bonding apparatus configured to bond a first substrate and a second substrate includes: a first holder configured to hold the first substrate; a second holder disposed to face the first holder in a vertical direction, and configured to hold the second substrate; a processing vessel accommodating the first holder and the second holder therein; and a horizontal position adjuster provided outside the processing vessel and connected to the first holder via a support supporting the first holder, the horizontal position adjuster being configured to adjust a horizontal position of the first holder.

公开(公告)号：US11417543B2

公开(公告)日：2022-08-16

申请号：US16508507

申请日：2019-07-11

Applicant: Tokyo Electron Limited

Inventor： Yoshitaka Otsuka ,  Munehisa Kodama ,  Yutaka Yamasaki

IPC: H01L21/67 ,  H01L21/683 ,  H01L21/20

Abstract: A bonding apparatus includes a first holder, a second holder, an imaging unit and a moving device. The first holder is configured to hold a first substrate. The second holder is disposed to face the first holder and configured to hold a second substrate to be bonded to the first substrate. The imaging unit includes a first imaging device configured to image a first alignment mark formed on a surface of the first substrate facing the second substrate and a second imaging device configured to image a second alignment mark formed on a surface of the second substrate facing the first substrate. The moving device is configured to move the imaging unit in a first direction and a second direction intersecting with the first direction within a plan region between the first holder and the second holder.

公开(公告)号：US12217963B2

公开(公告)日：2025-02-04

申请号：US17594973

申请日：2020-04-27

Applicant: Tokyo Electron Limited

Inventor： Yutaka Yamasaki ,  Takashi Terada

IPC: H01L23/544 ,  B23K20/02 ,  B23K20/233 ,  B23K20/24 ,  H01L21/18 ,  H01L21/67

Abstract: A bonding apparatus configured to bond a first substrate and a second substrate includes: a first holder configured to hold the first substrate; a second holder disposed to face the first holder in a vertical direction, and configured to hold the second substrate; a processing vessel accommodating the first holder and the second holder therein; and a horizontal position adjuster provided outside the processing vessel and connected to the first holder via a support supporting the first holder, the horizontal position adjuster being configured to adjust a horizontal position of the first holder.

公开(公告)号：US12157293B2

公开(公告)日：2024-12-03

申请号：US17820299

申请日：2022-08-17

Applicant: Tokyo Electron Limited

Inventor： Takashi Terada ,  Yuji Mimura ,  Hiroshi Maeda ,  Kazutaka Noda ,  Masaru Honda ,  Ryoichi Sakamoto ,  Yutaka Yamasaki ,  Tatsuya Kitayama ,  Akira Fukutomi

IPC: B32B43/00

Abstract: A separating method includes holding a combined substrate and separating a first substrate. In the holding of the combined substrate, the combined substrate in which the first substrate and a second substrate are bonded is held. In the separating of the first substrate, the first substrate is separated from the combined substrate, starting from a side surface of the combined substrate. The separating of the first substrate includes brining a fluid containing water into contact with the side surface.

公开(公告)号：US20220384386A1

公开(公告)日：2022-12-01

申请号：US17804163

申请日：2022-05-26

Applicant: Tokyo Electron Limited

Inventor： Yuji Mimura ,  Hiroshi Maeda ,  Takashi Terada ,  Masaru Honda ,  Ryoichi Sakamoto ,  Yutaka Yamasaki

IPC: H01L23/00 ,  H01J37/32

Abstract: A bonding system includes a surface modifying apparatus and a bonding apparatus. The surface modifying apparatus is configured to modify a bonding surface of a substrate to be bonded to another substrate with plasma of a processing gas. The bonding apparatus is configured to bond two substrates modified by the surface modifying apparatus by an intermolecular force. The surface modifying apparatus includes: a processing chamber configured to accommodate therein the substrate; a processing gas supply configured to supply a processing gas containing moisture into the processing chamber; and a plasma forming unit configured to form the plasma of the processing gas containing the moisture.

公开(公告)号：US20220285196A1

公开(公告)日：2022-09-08

申请号：US17594975

申请日：2020-04-27

Applicant: Tokyo Electron Limited

Inventor： Yutaka Yamasaki ,  Takashi Terada

IPC: H01L21/68 ,  H01L21/18 ,  H01L21/687 ,  H01L21/683

Abstract: A bonding apparatus configured to bond a first substrate and a second substrate includes a first holder configured to hold the first substrate; a second holder disposed to face the first holder, and configured to hold the second substrate; two imaging units each including a first imaging device configured to image a first alignment mark formed on a bonding surface of the first substrate and a second imaging device configured to image a second alignment mark formed on a bonding surface of the second substrate; a first moving mechanism configured to move the two imaging units along a first direction in a planar region between the first holder and the second holder; a second moving mechanism configured to move the first imaging unit along a second direction orthogonal to the first direction; and a third moving mechanism configured to move the second imaging unit along the second direction.

公开(公告)号：US20200020553A1

公开(公告)日：2020-01-16

申请号：US16508507

申请日：2019-07-11

Applicant: Tokyo Electron Limited

Inventor： Yoshitaka Otsuka ,  Munehisa Kodama ,  Yutaka Yamasaki

IPC: H01L21/67 ,  H01L21/20 ,  H01L21/683

Abstract: A bonding apparatus includes a first holder, a second holder, an imaging unit and a moving device. The first holder is configured to hold a first substrate. The second holder is disposed to face the first holder and configured to hold a second substrate to be bonded to the first substrate. The imaging unit includes a first imaging device configured to image a first alignment mark formed on a surface of the first substrate facing the second substrate and a second imaging device configured to image a second alignment mark formed on a surface of the second substrate facing the first substrate. The moving device is configured to move the imaging unit in a first direction and a second direction intersecting with the first direction within a plan region between the first holder and the second holder.