MULTILAYER WIRING BOARD
    1.
    发明申请
    MULTILAYER WIRING BOARD 有权
    多层接线板

    公开(公告)号:US20110155442A1

    公开(公告)日:2011-06-30

    申请号:US12975703

    申请日:2010-12-22

    Applicant: Tomoko YAMADA

    Inventor: Tomoko YAMADA

    Abstract: A multilayer wiring board has a structure in which vias are formed on an inner wiring layer in directions toward both surfaces of the inner wiring layer, respectively, and lands are each defined in the inner wiring layer at a position to be connected to one of the vias, each of the lands having a side surface formed in a tapered shape. The lands include first lands and second lands, and the vias include a via connected to a surface on a smaller diameter side of the first land, and a via connected only to a surface on a larger diameter side of the second land. The size of the surface of the larger diameter side of the second land is equal to the size of the surface of the smaller diameter side of the first land.

    Abstract translation: 多层布线基板具有分别在内部布线层上沿着内部布线层的两个表面的方向形成通孔的结构,并且在内部布线层中,在与第一布线层 通孔中的每一个具有形成为锥形的侧表面。 焊盘包括第一焊盘和第二焊盘,并且通孔包括连接到第一焊盘的较小直径侧的表面的通孔以及仅连接到第二焊盘的较大直径侧的表面的通孔。 第二焊盘的较大直径侧的表面的尺寸等于第一焊盘的较小直径侧的表面的尺寸。

    METHOD OF MANUFACTURING WIRING SUBSTRATE
    3.
    发明申请
    METHOD OF MANUFACTURING WIRING SUBSTRATE 有权
    制造接线基板的方法

    公开(公告)号:US20100096078A1

    公开(公告)日:2010-04-22

    申请号:US12579726

    申请日:2009-10-15

    Abstract: Two stacked bodies, each having a metal layer provided on a first metallic foil with carrier via a first insulating layer, are prepared. The first metallic foil with carrier has a metallic foil provided on a carrier plate via a peeling layer. A joined body is formed by jointing the stacked bodies such that the carrier plates are joined via a joining layer. First conductor patterns are formed by patterning the metal layers on both sides of the joined body. Second metallic foils with carrier are provided to the first conductor patterns of the joined body such that the first conductor patterns are opposed to the metallic foils via second insulating layers. Two substrates are formed by peeling the carrier plates with carrier from the peeling layers. Second conductor patterns which are connected electrically to the first conductor patterns are formed from the metallic foils of the substrate.

    Abstract translation: 准备两个层叠体,每个层叠体通过第一绝缘层具有设置在具有载体的第一金属箔上的金属层。 具有载体的第一金属箔具有通过剥离层设置在载体板上的金属箔。 通过接合层叠体形成接合体,使得承载板通过接合层接合。 通过在接合体的两侧上构图金属层来形成第一导体图案。 具有载体的第二金属箔被提供到接合体的第一导体图案,使得第一导体图案经由第二绝缘层与金属箔相对。 通过用载体从剥离层剥离载体板来形成两个基板。 与第一导体图案电连接的第二导体图案由基板的金属箔形成。

    ELECTRONIC DEVICE, DISPLAY DEVICE, AND SEMICONDUCTOR DEVICE AND METHOD FOR DRIVING THE SAME
    6.
    发明申请
    ELECTRONIC DEVICE, DISPLAY DEVICE, AND SEMICONDUCTOR DEVICE AND METHOD FOR DRIVING THE SAME 有权
    电子设备,显示设备和半导体器件及其驱动方法

    公开(公告)号:US20080225061A1

    公开(公告)日:2008-09-18

    申请号:US11877325

    申请日:2007-10-23

    Abstract: A pixel having a transistor which controls a current value supplied to a load, a first storage capacitor, a second storage capacitor, and first to fourth switches is included. After the threshold voltage of the transistor is held in the second storage capacitor, a potential in accordance with a video signal is input to the pixel. Voltage obtained by adding a potential in which the potential in accordance with the video signal and the first storage capacitor are capacitively divided to the threshold voltage is held in the second storage capacitor in this manner, so that variation of a current value caused by variations in the threshold voltage of the transistor is suppressed. Thus, desired current can be supplied to the load such as a light-emitting element. In addition, a display device with little deviation from luminance specified by the video signal can be provided.

    Abstract translation: 包括具有控制提供给负载的电流值的晶体管的像素,第一存储电容器,第二存储电容器和第一至第四开关。 在晶体管的阈值电压被保持在第二存储电容器中之后,根据视频信号的电位被输入到像素。 以这种方式将通过将其中根据视频信号的电位和第一存储电容器的电位电容性地划分为阈值电压而获得的电压保持在第二存储电容器中,使得由变化引起的电流值的变化 抑制晶体管的阈值电压。 因此,可以将期望的电流提供给诸如发光元件的负载。 此外,可以提供与视频信号指定的亮度几乎偏离的显示装置。

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