公开(公告)号：US11501982B1

公开(公告)日：2022-11-15

申请号：US17458765

申请日：2021-08-27

Applicant: U.S. Government as Represented by the Secretary of the Army

Inventor： Stephen Redington ,  Christopher Macrae ,  Matthew Sargent

IPC: H01L21/60 ,  H01L23/00 ,  H01L25/00 ,  H01L25/065

Abstract: A circuit assembly with an electrical connection between two individual Printed Circuit Boards (PCBs) or Circuit Card Assemblies (CCAs) that are vertically stacked with a connection formed entirely of solder and with a gap in between surfaces that components may occupy. Coalescing solder paste merges between the surfaces when it is in a liquid state to form a solder bridge. The resultant assembly can be encapsulated to form a solid monolithic electronic assembly to improve robustness and allow the assembly to better withstand compressive forces.