公开(公告)号：US20240314938A1

公开(公告)日：2024-09-19

申请号：US18185041

申请日：2023-03-16

Applicant: UNEO INC.

Inventor： Chih-Sheng HOU ,  Chia-Hung CHOU ,  Hsin-Lin YU ,  Si-Wei CHEN ,  Chueh CHIANG

IPC: H05K3/32 ,  H05K1/03

CPC classification number: H05K3/32 ,  H05K1/038 ,  H05K2201/0145 ,  H05K2201/029 ,  H05K2201/10287

Abstract: The present invention relates to an extension structure of flexible substrates with conductive wires thereon. In a first embodiment, three flexible substrates are prepared, each having multiple conductive wires configured on their front surfaces. The third flexible substrate is flipped over, with its conductive wires facing downwards, and bonded across a boundary formed by the first and second flexible substrates. As a result, the corresponding conductive wires between the first and second flexible substrates are electrically coupled with each other through being physically pressed by corresponding conductive wires in the third flexible substrate.