公开(公告)号：US10580350B2

公开(公告)日：2020-03-03

申请号：US15951548

申请日：2018-04-12

Applicant: UNIFLEX Technology Inc.

Inventor： Yuan-Chih Lee ,  Chia-Ming Li

IPC: G09G3/32 ,  H01L25/075 ,  H05B33/08 ,  H01L33/52

Abstract: A micro light emitting diode module contains: multiple flip-chip LEDs and a dielectric layer. The multiple flip-chip LEDs are arranged side by side. The flip-chip LEDs have a light emitting side and an electrical connecting side. The electrical connecting side of the flip-chip LEDs has a p-contact pad and an n pad. The dielectric layer is formed on the electrical connecting side of the flip-chip LEDs. The dielectric layer has multiple electric channels in which multiple electrical circuits are formed. The electrical circuits are corresponded to the p-contact pads and the n-contact pads of the flip-chip LEDs respectively, and each electrical circuit is electrically connected to its corresponding p-contact pad or n-contact pad. By reconstruction of circuits on LED array, the present invention not only has high processing yield, but also significantly reduces the manufacturing time. A method for making the micro light emitting diode module is also provided.