公开(公告)号：US20240314932A1

公开(公告)日：2024-09-19

申请号：US18136358

申请日：2023-04-19

Applicant: UNIMICRON TECHNOLOGY CORP.

Inventor： Chen-An TSAI

IPC: H05K1/16 ,  H01F17/00 ,  H01F41/04 ,  H05K1/11 ,  H05K3/46

CPC classification number: H05K1/165 ,  H01F17/0013 ,  H01F41/041 ,  H05K1/115 ,  H05K3/4644 ,  H05K2201/086 ,  H05K2201/09527 ,  H05K2201/09563 ,  H05K2201/1003

Abstract: The present invention includes an aluminum board, an electromagnet core, and a coil. The aluminum board includes a first surface, a second surface opposite to the first surface, and multiple through vias in communication with the first surface and the second surface. The electromagnet core is mounted on the first surface, and the through vias are located on two opposite sides of the electromagnet core. The coil is mounted through the through vias to wrap around the electromagnet core. An inside wall of each of the through vias forms an anodic aluminum oxide (AAO) by an anodizing process. The present invention is able to decrease via size of a conductive through via of a vertically embedded inductor. This allows through vias to be more densely formed on a board, and thus increases an amount of the coil wrapped around the electromagnetic core and increases inductance of the inductor.