公开(公告)号：US20240114632A1

公开(公告)日：2024-04-04

申请号：US18062739

申请日：2022-12-07

Applicant: UNIMICRON TECHNOLOGY CORP.

Inventor： Ming-Hao WU ,  Chia-Ching WANG

IPC: H05K3/42 ,  H05K1/11

CPC classification number: H05K3/429 ,  H05K1/115 ,  H05K2201/09509 ,  H05K2203/0207

Abstract: A circuit board structure is provided. The circuit board structure includes a via hole, a conductive layer, and an alternate stacking of a plurality of circuit layers and a plurality of insulating layers. The via hole penetrates through the plurality of circuit layers and the plurality of insulating layers. The lateral ends of the plurality of insulating layers form the sidewall of the via hole. The conductive layer is conformally disposed within the via hole. The conductive layer exposes the first region of the sidewall and covers the second region of the sidewall. The sidewall extends in the longitudinal direction of the via hole and has no misalignments in the radial direction.