公开(公告)号：US20250040051A1

公开(公告)日：2025-01-30

申请号：US18236280

申请日：2023-08-21

Applicant: UNIMICRON TECHNOLOGY CORP.

Inventor： Chun Hung KUO ,  Kuo-Ching CHEN ,  Yu-Cheng HUANG ,  Yu-Hua CHEN

IPC: H05K1/16 ,  H01G4/012 ,  H01G4/30 ,  H05K1/02 ,  H05K3/46

Abstract: A circuit carrier includes at least one wiring layer and a capacitive element. The capacitive element is disposed in at least one dielectric layer of the wiring layer. The capacitive element includes a lower electrode, an inter-electrode and an upper electrode. The inter-electrode is located between the lower electrode and the upper electrode. The inter-electrode includes a plate, at least one first finger and at least one second finger. The first finger and the second finger extend from opposite sides of the plate, respectively.

公开(公告)号：US20240179829A1

公开(公告)日：2024-05-30

申请号：US18095318

申请日：2023-01-10

Applicant: UNIMICRON TECHNOLOGY CORP.

Inventor： Chun Hung KUO

IPC: H05K1/02 ,  H05K3/46

CPC classification number: H05K1/0204 ,  H05K1/024 ,  H05K3/4673 ,  H05K3/4679 ,  H05K2201/0191 ,  H05K2201/0379 ,  H05K2203/0415

Abstract: A circuit board structure includes a build-up structure, a graphene layer disposed on the build-up structure, and at least one conductive pillar disposed on the graphene layer, the graphene layer includes an oxidized area not covered by the at least one conductive pillar and a non-oxidized area covered by the at least one conductive pillar, and the at least one conductive pillar is electrically connected to the build-up structure via the non-oxidized area.

公开(公告)号：US20240389232A1

公开(公告)日：2024-11-21

申请号：US18220548

申请日：2023-07-11

Applicant: UNIMICRON TECHNOLOGY CORP.

Inventor： Chun Hung KUO ,  Kuo-Ching CHEN ,  Yu-Cheng HUANG ,  Yu-Hua CHEN

IPC: H05K1/14 ,  H05K1/16 ,  H05K3/36

Abstract: A circuit board structure and a manufacturing method thereof. Circuit board structure includes first circuit board, second circuit board, conductive coil, magnetic body and molding compound. First circuit board has first side surface and first cavity located on first side surface. Second circuit board has second side surface facing first side surface and being spaced apart from first side surface. Conductive coil is in a spiral shape and includes first coil pattern and second coil pattern. First coil pattern is disposed in first circuit board. Second coil pattern is disposed in second circuit board. First coil pattern is electrically connected to second coil pattern. Magnetic body is filled in first cavity of first circuit board. Conductive coil surrounds at least a part of magnetic body. Molding compound is filled in a gap between first side surface and second side surface.

公开(公告)号：US20220217841A1

公开(公告)日：2022-07-07

申请号：US17185216

申请日：2021-02-25

Applicant: UNIMICRON TECHNOLOGY CORP.

Inventor： Chun Hung KUO ,  Kuo Ching CHEN

IPC: H05K1/02 ,  H05K3/20

Abstract: A circuit board is manufactured by mounting a first circuit layer, mounting a conductive bump on the first circuit layer, covering the first circuit layer with a first dielectric layer which exposes the conductive bump, mounting a second dielectric layer on the first dielectric layer with a second dielectric layer opening that exposes the conductive bump, and finally, mounting a second circuit layer on the surface of the second dielectric layer and in the second dielectric layer opening. Since the surface roughness of the second dielectric layer and the second dielectric layer opening is low, it is unlikely to form nano voids between the second dielectric layer and the second circuit layer, and the second circuit layer may be attached to the second dielectric layer firmly, which is an advantage for fine line circuit disposal.

公开(公告)号：US20250089173A1

公开(公告)日：2025-03-13

申请号：US18388483

申请日：2023-11-09

Applicant: UNIMICRON TECHNOLOGY CORP.

Inventor： Chun Hung KUO ,  Kuo-Ching CHEN ,  Yu-Cheng HUANG ,  Yu-Hua CHEN

IPC: H05K1/18 ,  H05K3/40

Abstract: A circuit board structure includes a core, a wiring layer and a buried passive component. The wiring layer and the buried passive component are disposed on the core, and the buried passive component is electrically connected to the wiring layer. The buried passive component includes a first spiral metal layer, a second spiral metal layer and a dielectric interlayer. The first spiral metal layer is intertwined with the second spiral metal layer. The dielectric interlayer is disposed between the first spiral metal layer and the second spiral metal layer. The first spiral metal layer and the second spiral metal layer are spaced apart by the dielectric interlayer at least in the core.

公开(公告)号：US20240381533A1

公开(公告)日：2024-11-14

申请号：US18205240

申请日：2023-06-02

Applicant: UNIMICRON TECHNOLOGY CORP.

Inventor： Chun Hung KUO ,  Kuo-Ching CHEN ,  Yu-Cheng HUANG ,  Yu-Hua CHEN

IPC: H05K1/14 ,  H05K1/02 ,  H05K1/11 ,  H05K3/00

Abstract: A circuit board structure including a first circuit board, a second circuit board, a conductive coil and a first molding compound and a manufacturing method thereof. The first circuit board has a first side surface. The second circuit board has a second side surface facing the first side surface and being spaced apart from the first side surface. The conductive coil is in a spiral shape and includes a first coil pattern and a second coil pattern. The first coil pattern is disposed in the first circuit board. The second coil pattern is disposed in the second circuit board. The first coil pattern is electrically connected to the second coil pattern. The first molding compound is magnetic and filled in a gap located between the first side surface and the second side surface. The conductive coil surrounds at least a part of the first molding compound.