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公开(公告)号:US11897125B2
公开(公告)日:2024-02-13
申请号:US16788263
申请日:2020-02-11
Inventor: Sang Hoon Kang , Hyunah Kang
CPC classification number: B25J19/0095 , A61B5/4528 , A61B2560/0223 , F16F2230/0005 , G01L1/04 , G01L5/161
Abstract: A 3D spring array device includes: a fixed body having an internal space therein; a moving body positioned in a center of an x-y-z orthogonal coordinate system in the internal space, wherein the moving body is configured to be fastenable to the end effector of the mechanical impedance estimating robot; and a first spring, a second spring, a third spring, a fourth spring, a fifth spring, a sixth spring, a seventh spring, and an eighth spring and configured to connect the fixed body to the moving body in the internal space.