公开(公告)号：US12009415B2

公开(公告)日：2024-06-11

申请号：US18144811

申请日：2023-05-08

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Kuo-Hsing Lee ,  Sheng-Yuan Hsueh ,  Chien-Liang Wu ,  Kuo-Yu Liao

IPC: H01L29/778 ,  H01L27/06 ,  H01L29/06 ,  H01L29/20 ,  H01L29/66

CPC classification number: H01L29/778 ,  H01L27/0629 ,  H01L29/0649 ,  H01L29/2003 ,  H01L29/66462

Abstract: A semiconductor device includes a substrate having a high electron mobility transistor (HEMT) region and a capacitor region, a first mesa isolation on the HEMT region, a HEMT on the first mesa isolation, a second mesa isolation on the capacitor region, and a capacitor on the second mesa isolation. The semiconductor device further includes buffer layer between the substrate, the first mesa isolation, and the second mesa isolation, in which bottom surfaces of the first mesa isolation and the second mesa isolation are coplanar.

公开(公告)号：US11864391B2

公开(公告)日：2024-01-02

申请号：US18088761

申请日：2022-12-26

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Kuo-Hsing Lee ,  Sheng-Yuan Hsueh ,  Te-Wei Yeh ,  Chien-Liang Wu

IPC: H10B61/00 ,  G11C7/18 ,  H10N50/80

CPC classification number: H10B61/20 ,  G11C7/18 ,  H10N50/80

Abstract: A magnetoresistive random access memory (MRAM) includes a first transistor and a second transistor on a substrate, a source line coupled to a first source/drain region of the first transistor, and a first metal interconnection coupled to a second source/drain region of the first transistor. Preferably, the first metal interconnection is extended to overlap the first transistor and the second transistor and the first metal interconnection further includes a first end coupled to the second source/drain region of the first transistor and a second end coupled to a magnetic tunneling junction (MTJ).

公开(公告)号：US20230380148A1

公开(公告)日：2023-11-23

申请号：US17844076

申请日：2022-06-20

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Kuo-Hsing Lee ,  Chun-Hsien Lin ,  Chih-Kai Kang ,  Ting-Hsiang Huang ,  Chien-Liang Wu ,  Sheng-Yuan Hsueh ,  Chi-Horn Pai

IPC: H01L27/112

CPC classification number: H01L27/11206

Abstract: A method for fabricating a semiconductor device includes the steps of first providing a substrate having an one time programmable (OTP) device region, forming a shallow trench isolation (STI) in the substrate, forming a first doped region adjacent to the STI, removing part of the STI, and then forming a first gate structure on the substrate and the STI. Preferably, the first gate structure includes a high-k dielectric layer on the substrate and a gate electrode on the high-k dielectric layer, in which the high-k dielectric layer comprises a first L-shape.

公开(公告)号：US11765891B2

公开(公告)日：2023-09-19

申请号：US17391067

申请日：2021-08-02

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Kuo-Hsing Lee ,  Sheng-Yuan Hsueh ,  Chun-Hsien Lin ,  Yung-Chen Chiu ,  Chien-Liang Wu ,  Te-Wei Yeh

IPC: H10B20/20 ,  H10B20/25

CPC classification number: H10B20/20 ,  H10B20/25

Abstract: A one-time programmable (OTP) memory cell includes a substrate having a first conductivity type and having an active area surrounded by an isolation region, a transistor disposed on the active area, and a capacitor disposed on the active area and electrically coupled to the transistor. The capacitor comprises a diffusion region of a second conductivity type in the substrate, a metallic film in direct contact with the active area, a capacitor dielectric layer on the metallic film, and a metal gate surrounded by the capacitor dielectric layer. The diffusion region and the metallic film constitute a capacitor bottom plate.

公开(公告)号：US20230223399A1

公开(公告)日：2023-07-13

申请号：US18119253

申请日：2023-03-08

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Kuo-Hsing Lee ,  Sheng-Yuan Hsueh ,  Chien-Liang Wu ,  Te-Wei Yeh ,  Yi-Chun Chen

IPC: H01L27/06 ,  H01L29/778 ,  H01L29/205 ,  H01L21/306 ,  H01L29/40 ,  H01L21/765 ,  H01L21/8252 ,  H01L29/20 ,  H01L29/66

CPC classification number: H01L27/0605 ,  H01L29/7786 ,  H01L29/205 ,  H01L21/30621 ,  H01L29/402 ,  H01L27/0629 ,  H01L21/765 ,  H01L21/8252 ,  H01L28/20 ,  H01L29/2003 ,  H01L29/66462

Abstract: A resistor with GaN structures, including a GaN layer with a 2DEG resistor region and an undoped polysilicon resistor region, an AlGaN barrier layer on the GaN layer in the 2DEG resistor region, multiple p-type doped GaN capping layers arranged on the AlGaN barrier layer so that the GaN layer not covered by the p-type doped GaN capping layers in the 2DEG resistor region is converted into a 2DEG resistor, a passivation layer on the GaN layer, and an undoped polysilicon layer on the passivation layer in the undoped polysilicon resistor region and functions as an undoped polysilicon resistor.

公开(公告)号：US11631664B2

公开(公告)日：2023-04-18

申请号：US17075707

申请日：2020-10-21

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Kuo-Hsing Lee ,  Sheng-Yuan Hsueh ,  Chien-Liang Wu ,  Te-Wei Yeh ,  Yi-Chun Chen

IPC: H01L27/06 ,  H01L29/20 ,  H01L29/205 ,  H01L29/40 ,  H01L29/66 ,  H01L29/778 ,  H01L49/02 ,  H01L21/306 ,  H01L21/765 ,  H01L21/8252

Abstract: A resistor-transistor-logic (RTL) circuit with GaN structure, including a GaN layer, a AlGaN barrier layer on the GaN layer, multiple p-type doped GaN capping layers on the AlGaN barrier layer, wherein parts of the p-type doped GaN capping layers in a high-voltage region and in a low-voltage region convert the underlying GaN layer into gate depletion areas, the GaN layer not covered by the p-type doped GaN capping layers in a resistor region becomes a 2DEG resistor.

公开(公告)号：US20250040148A1

公开(公告)日：2025-01-30

申请号：US18916719

申请日：2024-10-16

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Kuo-Hsing Lee ,  Sheng-Yuan Hsueh ,  Te-Wei Yeh ,  Chien-Liang Wu

IPC: H10B61/00 ,  G11C7/18 ,  H10N50/80

Abstract: A magnetoresistive random access memory (MRAM) includes a first transistor and a second transistor on a substrate, a source line coupled to a first source/drain region of the first transistor, and a first metal interconnection coupled to a second source/drain region of the first transistor. Preferably, the first metal interconnection is extended to overlap the first transistor and the second transistor and the first metal interconnection further includes a first end coupled to the second source/drain region of the first transistor and a second end coupled to a magnetic tunneling junction (MTJ).

公开(公告)号：US12119342B2

公开(公告)日：2024-10-15

申请号：US18119253

申请日：2023-03-08

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Kuo-Hsing Lee ,  Sheng-Yuan Hsueh ,  Chien-Liang Wu ,  Te-Wei Yeh ,  Yi-Chun Chen

IPC: H01L27/06 ,  H01L21/306 ,  H01L21/765 ,  H01L21/8252 ,  H01L29/20 ,  H01L29/205 ,  H01L29/40 ,  H01L29/66 ,  H01L29/778 ,  H01L49/02

CPC classification number: H01L27/0605 ,  H01L21/30621 ,  H01L21/765 ,  H01L21/8252 ,  H01L27/0629 ,  H01L28/20 ,  H01L29/2003 ,  H01L29/205 ,  H01L29/402 ,  H01L29/66462 ,  H01L29/7786

Abstract: A resistor with GaN structures, including a GaN layer with a 2DEG resistor region and an undoped polysilicon resistor region, an AlGaN barrier layer on the GaN layer in the 2DEG resistor region, multiple p-type doped GaN capping layers arranged on the AlGaN barrier layer so that the GaN layer not covered by the p-type doped GaN capping layers in the 2DEG resistor region is converted into a 2DEG resistor, a passivation layer on the GaN layer, and an undoped polysilicon layer on the passivation layer in the undoped polysilicon resistor region and functions as an undoped polysilicon resistor.

公开(公告)号：US20240290875A1

公开(公告)日：2024-08-29

申请号：US18656574

申请日：2024-05-06

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Kuo-Hsing Lee ,  Sheng-Yuan Hsueh ,  Chien-Liang Wu ,  Kuo-Yu Liao

IPC: H01L29/778 ,  H01L27/06 ,  H01L29/06 ,  H01L29/20 ,  H01L29/66

CPC classification number: H01L29/778 ,  H01L27/0629 ,  H01L29/0649 ,  H01L29/2003 ,  H01L29/66462

Abstract: A semiconductor device includes a substrate having a high electron mobility transistor (HEMT) region and a capacitor region, a first mesa isolation on the HEMT region, a HEMT on the first mesa isolation, a second mesa isolation on the capacitor region, and a capacitor on the second mesa isolation. The semiconductor device further includes buffer layer between the substrate, the first mesa isolation, and the second mesa isolation, in which bottom surfaces of the first mesa isolation and the second mesa isolation are coplanar.

公开(公告)号：US20240234559A1

公开(公告)日：2024-07-11

申请号：US18614735

申请日：2024-03-24

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Kuo-Hsing Lee ,  Sheng-Yuan Hsueh ,  Chien-Liang Wu ,  Kuo-Yu Liao

IPC: H01L29/778 ,  H01L27/06 ,  H01L29/06 ,  H01L29/20 ,  H01L29/66

CPC classification number: H01L29/778 ,  H01L27/0629 ,  H01L29/0649 ,  H01L29/2003 ,  H01L29/66462

Abstract: A method for fabricating a semiconductor device includes the steps of first providing a substrate having a high electron mobility transistor (HEMT) region and a capacitor region, forming a buffer layer on the substrate, forming a mesa isolation on the HEMT region, forming a HEMT on the mesa isolation, and then forming a capacitor on the capacitor region. Preferably, a bottom electrode of the capacitor contacts the buffer layer directly.