-
公开(公告)号：US20240281676A1
公开(公告)日：2024-08-22
申请号：US18127018
申请日：2023-03-28
Applicant: UNITED MICROELECTRONICS CORP.
Inventor： Ming-I HO , Tzu-Chin TSENG , Hsin-Yu CHEN , Ming-Wei CHEN
CPC classification number: G06N5/04 , G06N5/022 , H01L21/67253 , H01L21/67276
Abstract: A method and a system for predicting etching recipe are provided, wherein the method includes steps as follows: Firstly, a plurality of etching recipes of existing etched products and a plurality sets of position-optical measurement values corresponding to the plurality of etching recipes are collected. Then, a supervised learning training is performed according to a plurality of optical measurement values in each set of the position-optical measurement values to build a predicting model. A specification data of a product to be etched including a position-optical parameter is input into this predicting model to obtain a prediction result. Subsequently, according to the prediction result, one of the plurality of etching recipes of the existing etched products is selected as a suggested etching recipe for the product to be etched.
-
2.发明公开公开(公告)号：US20230238262A1
公开(公告)日：2023-07-27
申请号：US17695299
申请日：2022-03-15
Applicant: UNITED MICROELECTRONICS CORP.
Inventor： Hsiao-Ying YANG , Ching-Pei LIN , Chung-Yi CHIU , Ming-Wei CHEN , Te-Hsuan CHEN , Chia-Wei CHEN , Wen-Shan HUANG
CPC classification number: H01L21/67276 , G06N20/00
Abstract: A semiconductor manufacturing process prediction method and a semiconductor manufacturing process prediction device are provided. The semiconductor manufacturing process prediction method includes the following steps. A plurality of process data are obtained. According to the process data, a machine learning model is used to execute prediction and obtain a prediction confidence and a prediction yield. Whether the prediction confidence is lower than a predetermined level is determined. If the prediction confidence is lower than the predetermined level, the machine learning model is modified. According to the process data, the prediction yield is adjusted.
-
公开(公告)号：US20230236553A1
公开(公告)日：2023-07-27
申请号：US17695255
申请日：2022-03-15
Applicant: UNITED MICROELECTRONICS CORP.
Inventor： Chia-Wei CHEN , Ching-Pei LIN , Chung-Yi CHIU , Te-Hsuan CHEN , Ming-Wei CHEN , Hsiao-Ying YANG
CPC classification number: G05B13/048 , H01L22/14 , H01L22/12
Abstract: A training method of a semiconductor process prediction model, a semiconductor process prediction device, and a semiconductor process prediction method are provided. The training method of the semiconductor process prediction model includes the following steps. The semiconductor process was performed on several samples. A plurality of process data of the samples are obtained. A plurality of electrical measurement data of the samples are obtained. Some of the samples having physical defects are filtered out according to the process data. The semiconductor process prediction model is trained according to the process data and the electrical measurement data of the filtered samples.
-
公开(公告)号：US20210358071A1
公开(公告)日：2021-11-18
申请号：US16906263
申请日：2020-06-19
Applicant: UNITED MICROELECTRONICS CORP.
Inventor： Yu-Chi LIN , Li-Hsin YANG , Ching-Pei LIN , Ming-Wei CHEN , Wei-Hong ZHU
Abstract: An automatic adjusting method for equipment and a smart adjusting device using the same are provided. The automatic adjusting method of the equipment includes the following steps. A template frame from the equipment is obtained in an initial period. Several clear frames are obtained in one window period. Each of the template frame and the clear frame has a pixel variation. The pixel variation of the template frame is the largest in the initial period. The pixel variation of each of the clear frame is greater than a threshold. Each of the clear frame is compared with the template frame to obtain an offset. A statistical value of the offsets is calculated. A parameter of the equipment is adjusted to reduce the statistical value.
-
-
-
Search Results
4
records
(took 0.01 seconds)
