公开(公告)号：US20130302933A1

公开(公告)日：2013-11-14

申请号：US13945892

申请日：2013-07-18

Applicant: UNITED MICROELECTRONICS CORPORATION

Inventor： Tzung-Han TAN ,  Bang-Chiang Lan ,  Ming-I Wang ,  Chien-Hsin Huang ,  Meng-Jia Lin

IPC: B81C1/00

CPC classification number: B81C1/00246 ,  B81B3/0072 ,  B81B2203/04 ,  B81B2207/015 ,  B81C2201/0167

Abstract: A microelectromechanical system (MEMS) device and a method for fabricating the same are described. The method of the present invention includes the following steps. A substrate is provided, including a circuit region and a MEMS region separated from each other. An interconnection structure is formed on the substrate in the circuit region, and simultaneously a plurality of dielectric layers and a first electrode are formed on the substrate in the MEMS region. The first electrode includes at least two metal layers and a protection ring. The metal layers and the protection ring are formed in the dielectric layers. The protection ring connects two adjacent metal layers, so as to define an enclosed space between the two adjacent metal layers. A second electrode is formed on the first electrode. The dielectric layers outside the enclosed space in the MEMS region are removed to form a cavity between the electrodes.

Abstract translation: 描述了微机电系统（MEMS）装置及其制造方法。 本发明的方法包括以下步骤。 提供了包括彼此分离的电路区域和MEMS区域的衬底。 在电路区域的基板上形成有互连结构，在MEMS区域的基板上同时形成有多个电介质层和第一电极。 第一电极包括至少两个金属层和保护环。 金属层和保护环形成在电介质层中。 保护环连接两个相邻的金属层，以便限定两个相邻金属层之间的封闭空间。 在第一电极上形成第二电极。 除去MEMS区域中的封闭空间外的电介质层，以在电极之间形成空腔。

公开(公告)号：US09150407B2

公开(公告)日：2015-10-06

申请号：US13945892

申请日：2013-07-18

Applicant: UNITED MICROELECTRONICS CORPORATION

Inventor： Tzung-Han Tan ,  Bang-Chiang Lan ,  Ming-I Wang ,  Chien-Hsin Huang ,  Meng-Jia Lin

IPC: H04R31/00 ,  B81C1/00 ,  B81B3/00

CPC classification number: B81C1/00246 ,  B81B3/0072 ,  B81B2203/04 ,  B81B2207/015 ,  B81C2201/0167

Abstract: A method for fabricating a microelectromechanical system (MEMS) device of the present invention includes the following steps: providing a substrate, comprising a circuit region and a MEMS region separated from each other; forming an interconnection structure on the substrate in the circuit region, and simultaneously forming a plurality of dielectric layers and a first electrode on the substrate in the MEMS region, wherein the first electrode comprises at least two metal layers formed in the dielectric layers and a protection ring formed in the dielectric layers and connecting two adjacent metal layers, so as to define an enclosed space between the two adjacent metal layers; forming a second electrode on the first electrode; and removing the dielectric layers outside the enclosed space in the MEMS region to form a cavity between the electrodes.

Abstract translation: 本发明的微机电系统（MEMS）器件的制造方法包括以下步骤：提供包括彼此分离的电路区域和MEMS区域的衬底; 在所述电路区域中的所述衬底上形成互连结构，并且在所述MEMS区域中的所述衬底上同时形成多个电介质层和第一电极，其中所述第一电极包括形成在所述电介质层中的至少两个金属层和保护层 环形成在电介质层中并连接两个相邻的金属层，以便限定两个相邻金属层之间的封闭空间; 在所述第一电极上形成第二电极; 并且去除MEMS区域中的封闭空间外的电介质层，以在电极之间形成空腔。