NONWOVEN JOINT TAPE HAVING LOW MOISTURE EXPANSION PROPERTIES AND METHOD FOR USING SAME
    3.
    发明申请
    NONWOVEN JOINT TAPE HAVING LOW MOISTURE EXPANSION PROPERTIES AND METHOD FOR USING SAME 有权
    具有低水分膨胀特性的非金属接头带及其使用方法

    公开(公告)号:US20160273234A1

    公开(公告)日:2016-09-22

    申请号:US15165926

    申请日:2016-05-26

    Abstract: The invention is directed to a joint tape for finishing a joint between boards comprising a nonwoven substrate that does not swell substantially in the presence of water. The invention further provides a method of finishing a joint between boards comprising (i) applying a joint tape of the invention to a joint between boards by embedding the joint tape in a first coat of joint compound, (ii) applying a second coat of joint compound over the tape, wherein step (ii) is carried out before the joint tape and joint compound applied in step (i) have substantially dried, and optionally (iii) applying a third fill or finish coat of joint compound over the tape, wherein step (iii) is carried out before the joint tape and second coat have substantially dried.

    Abstract translation: 本发明涉及一种用于整理板之间的接头的接合带,其包括在存在水的情况下基本上不膨胀的非织造基底。 本发明还提供了一种完成板之间接合的方法,包括(i)通过将接合带嵌入第一涂层接合组合物中,将本发明的接合带施加到板之间的接合处,(ii)施加第二接缝涂层 其中步骤(ii)在步骤(i)中施加的接合带和接头化合物基本上干燥之前进行,并且任选地(iii)在带上施加第三填充或涂层的接合化合物,其中 步骤(iii)在接合带和第二涂层基本干燥之前进行。

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