公开(公告)号：US20220073731A1

公开(公告)日：2022-03-10

申请号：US17424319

申请日：2020-02-12

Applicant: UNITIKA LTD.

Inventor： Toshiki NAGAHATA ,  Takatoshi MURAKAMI

IPC: C08L67/03 ,  C08L69/00 ,  C08K5/5419 ,  C08K5/524 ,  C08K5/5393

Abstract: The present invention provides a polyarylate resin composition sufficiently excellent in heat resistance, transparency, heat discoloration resistance and moist heat resistance, and a molded article made of the same. The present invention relates to a polyarylate resin composition containing 0.005˜5 parts by mass of a silane compound (C) with a boiling point of 200° C. or more, based on 100 parts by mass of the total of a polyarylate resin (A) and a polycarbonate resin (B), a content ratio of the polyarylate resin (A) and the polycarbonate resin (B) being 5/95 to 95/5 (mass ratio).

公开(公告)号：US20220106435A1

公开(公告)日：2022-04-07

申请号：US17426228

申请日：2020-01-21

Applicant: UNITIKA LTD.

Inventor： Ayumi YANAKA ,  Yumeto FUKUBAYASHI ,  Takatoshi MURAKAMI

IPC: C08G59/40 ,  C08G59/42 ,  C08G59/22 ,  C08G59/32 ,  C08J5/24 ,  C08J5/04 ,  C08L63/00 ,  C08G59/02

Abstract: The present invention provides an epoxy resin solution, from which an epoxy resin-cured product adequately excellent in heat-resisting properties and dielectric properties can be obtained with adequately good working properties ensured. The present invention relates to an epoxy resin solution containing at least a curing agent and an epoxy resin mixed in an organic solvent, wherein the curing agent comprises an imide group-containing curing agent having 1-4 imide groups and 2-4 glycidyl group-reactive functional groups in a molecule.