公开(公告)号：US20230377121A1

公开(公告)日：2023-11-23

申请号：US18319281

申请日：2023-05-17

Applicant: UNITY SEMICONDUCTOR

Inventor： Wolfgang Alexander IFF ,  Alain COURTEVILLE

IPC: G06T7/00 ,  B81C99/00 ,  G06T7/521 ,  G06T7/60 ,  G01B11/22

CPC classification number: G06T7/0004 ,  B81C99/003 ,  G06T7/521 ,  G06T7/60 ,  G01B11/22 ,  G06T2207/30148

Abstract: A method for characterizing structures etched in a substrate, such as a wafer is disclosed. The method includes the following steps: illuminating the bottom of at least one structure with an illumination beam issued from a light source emitting light with a wavelength adapted to be transmitted through the substrate, acquiring, with an imaging device positioned on the bottom side of said substrate, at least one image of a bottom of the at least one structure through the substrate, and measuring at least one data, called lateral data, relating to a lateral dimension of the bottom of the at least one HAR structure from the at least one acquired image. A system implementing such a method is also disclosed.

公开(公告)号：US20240281955A1

公开(公告)日：2024-08-22

申请号：US18651957

申请日：2024-05-01

Applicant: UNITY SEMICONDUCTOR

Inventor： Wolfgang Alexander IFF ,  Alain COURTEVILLE

IPC: G06T7/00 ,  B81C99/00 ,  G01B11/22 ,  G06T7/521 ,  G06T7/60

CPC classification number: G06T7/0004 ,  B81C99/003 ,  G01B11/22 ,  G06T7/521 ,  G06T7/60 ,  G06T2207/30148

Abstract: A method for characterizing structures etched in a substrate, such as a wafer is disclosed. A bottom of the structure is embedded in the substrate, the substrate having a top side in which the structures are etched and a bottom side opposite to the top side. The method includes the following steps: illuminating the bottom of at least one structure with an illumination beam issued from a light source emitting light with a wavelength adapted to be transmitted through the substrate, acquiring, with an imaging device positioned on the bottom side of said substrate, at least one image of a bottom of the at least one structure through the substrate, and measuring at least one data, called lateral data, relating to a lateral dimension of the bottom of the at least one HAR structure from the at least one acquired image. A system implementing such a method is also disclosed.