公开(公告)号：US6436853B2

公开(公告)日：2002-08-20

申请号：US79445501

申请日：2001-02-27

Applicant: UNIV MICHIGAN

Inventor： LIN LIWEI ,  CHENG YU-TING ,  NAJAFI KHALIL ,  WISE KENSALL D

IPC: B81B7/00 ,  B81C1/00 ,  H03H3/007 ,  H03H9/10 ,  H01L21/00 ,  H01L23/20

CPC classification number: H03H9/1057 ,  B81C1/00269 ,  B81C2203/0181 ,  G01P2015/0828 ,  H01L2924/16235 ,  H03H3/0072

Abstract: A method for making a microstructure assembly, the method including the steps of providing a first substrate and a second substrate; depositing an electrically conductive material on the second substrate; contacting the second substrate carrying the electrically conductive material with the first substrate; and then supplying current to the electrically conductive material to locally elevate the temperature of said electrically conductive material and cause formation of a bond between the first substrate and the second substrate.

Abstract translation: 一种制造微结构组件的方法，所述方法包括提供第一基板和第二基板的步骤; 在第二基板上沉积导电材料; 使承载导电材料的第二基板与第一基板接触; 然后向导电材料提供电流以局部地升高所述导电材料的温度，并引起在第一衬底和第二衬底之间形成结合。