公开(公告)号：US11655379B2

公开(公告)日：2023-05-23

申请号：US17182814

申请日：2021-02-23

Applicant: UNIVERSITY OF ELECTRONIC SCIENCE AND TECHNOLOGY OF CHINA

Inventor： Guoyun Zhou ,  Yan Hong ,  Jiujuan Li ,  Wei He ,  Yuanming Chen ,  Shouxu Wang ,  Dainan Zhang ,  Chong Wang

IPC: C09D5/24 ,  C09D165/00 ,  C25D3/38 ,  C25D21/10 ,  C25D5/56 ,  C08G73/02 ,  C08K3/08

CPC classification number: C09D5/24 ,  C08G73/0266 ,  C09D165/00 ,  C25D3/38 ,  C25D5/56 ,  C25D21/10 ,  C08K2003/085 ,  C08K2003/0806 ,  C08K2201/001

Abstract: A composite conductive polymer, a preparation method thereof and application thereof are disclosed, wherein a mixed solution A is used in the preparation process of the composite conductive polymer, which comprises the following two components: (i) a strong oxidant selected from at least one of permanganate, persulfate, dichromate and perchlorate; (ii) an oxidizing agent containing a metal ion capable of being reduced to elementary substance. The preparation process is simple and easy to operate, with low cost and favorable environmental protection and the obtained composite conductive polymer containing metal in elementary form, has good film-forming property and the film thereof can completely cover the surface of the insulating substrate, with excellent electrical conductivity, which therefore can be widely used in electroplating materials and semiconductor materials and other fields.

公开(公告)号：US12300511B1

公开(公告)日：2025-05-13

申请号：US19021887

申请日：2025-01-15

Applicant: University of Electronic Science and Technology of China ,  Zhuhai YUEXIN Semiconductor Limited Liability Company

Inventor： Xianming Chen ,  Yuanming Chen ,  Lei Feng ,  Benxia Huang ,  Yongzhi Zeng ,  Wei He ,  Yanlin Dong

IPC: H01L21/48 ,  H01L23/00

Abstract: In a fabrication method for a package structure, a copper foil is provided, electroplating is performed on the copper foil to form a cavity sacrificial post, a dielectric material is laminated to form a dielectric layer, wherein an end face of the cavity sacrificial post is exposed to the dielectric layer, a wiring layer is formed on the dielectric layer, the cavity sacrificial post is removed by etching to form a through cavity, a bonding pad is formed on the wiring layer, a reverse side of a device is mounted on the copper foil in the through cavity, and a terminal of the device is wire-bonded with the bonding pad.