公开(公告)号：US09997425B2

公开(公告)日：2018-06-12

申请号：US15207797

申请日：2016-07-12

Applicant: UNIVERSITY OF WINDSOR

Inventor： Sazzadur Chowdhury ,  Horst Schmidt

IPC: H01L23/00 ,  H01L23/31

CPC classification number: H01L23/31 ,  H01L21/4857 ,  H01L23/145 ,  H01L23/3121 ,  H01L23/49822 ,  H01L23/5389

Abstract: An integrated circuit includes stacked benzocyclobutene layers and a circuit geometry comprising conductive electric traces and interconnects on and/or extending through the BCB layers. A first said BCB layer formed and partially cured state. A top surface masked with photoresist, and after exposure, etched selectively form through vias at locations corresponding to conductive interconnects of the circuit geometry associated with said first BCB layer. A further mask coating is applied and after exposure, conductive metal is deposited to infill vias and form the electric traces of the circuit geometry. Subsequent BCB layers are then likewise formed, etched masked and coated in the same manner.