公开(公告)号：US20160177455A1

公开(公告)日：2016-06-23

申请号：US14909552

申请日：2014-06-02

Applicant: UNIVERSITY OF WINDSOR

Inventor： Mordechay SCHLESINGER ,  Robert PETRO

IPC: C23C28/02 ,  C25D21/02 ,  C25D5/18 ,  C25D3/12 ,  C23C18/16 ,  C23C18/50

CPC classification number: C23C28/023 ,  C23C18/1637 ,  C23C18/1653 ,  C23C18/1671 ,  C23C18/1676 ,  C23C18/168 ,  C23C18/34 ,  C23C18/36 ,  C23C18/44 ,  C23C18/50 ,  C23C18/52 ,  C23C28/021 ,  C25D3/12 ,  C25D3/38 ,  C25D3/562 ,  C25D5/18 ,  C25D17/10 ,  C25D21/02

Abstract: A hybrid electro-electroless deposition process whereby multiple metal films layers are deposited from a single plating solution which includes both electroless and electroplating components. The article to be plated is immersed in the solution, and electric current is selectively applied at determined voltages for predetermined times, at selected intervals to effect electroplating in conjunction with electroless deposition. Electroplated metal layers are interspersed with electroless deposited metal layers.

Abstract translation: 一种混合电化学沉积工艺，其中由包括无电镀和电镀组分的单一电镀溶液沉积多个金属膜层。 将待镀的物品浸入溶液中，并以选定的间隔选择性地以确定的电压施加电流达预定时间，以实现与无电沉积结合的电镀。 电镀金属层散布着无电沉积金属层。