公开(公告)号：US09340003B2

公开(公告)日：2016-05-17

申请号：US13919711

申请日：2013-06-17

Applicant: Unimicron Technology Corp.

Inventor： Chen-Chuan Chang

IPC: B32B38/10 ,  H05K3/46

CPC classification number: B32B38/10 ,  H05K3/4623 ,  H05K3/4652 ,  H05K3/4697 ,  H05K2201/0355 ,  H05K2201/09127 ,  H05K2203/107 ,  Y10T156/1052

Abstract: A manufacturing method of a circuit board comprises the following steps. Firstly, provide a first core layer, a second core material layer, and a central dielectric material layer. Secondly, press the first core layer, the second core material layer, and the central dielectric material layer to form a composite circuit structure. Thirdly, removing a portion of the central dielectric material layer located at a periphery of a pre-removing area and a portion of the second core material layer located at the periphery of the pre-removing area. Finally, remove a portion of the central dielectric material layer located within the pre-removing area and a portion of the second core material layer located within the pre-removing area to form a central dielectric layer and a second core layer.

Abstract translation: 电路板的制造方法包括以下步骤。 首先，提供第一芯层，第二芯材料层和中心电介质材料层。 其次，按压第一芯层，第二芯材料层和中心电介质材料层以形成复合电路结构。 第三，去除位于预除去区域的周边的中央电介质材料层的一部分和位于预除去区域周边的第二芯材料层的一部分。 最后，去除位于预除去区域内的中心电介质材料层的一部分和位于预去除区域内的第二芯材料层的一部分以形成中心电介质层和第二芯层。

公开(公告)号：US20130212877A1

公开(公告)日：2013-08-22

申请号：US13846871

申请日：2013-03-18

Applicant: Unimicron Technology Corp.

Inventor： Chen-Chuan Chang

IPC: H05K3/00

CPC classification number: H05K3/007 ,  H05K1/183 ,  H05K3/0035 ,  H05K3/06 ,  H05K3/062 ,  H05K3/108 ,  H05K3/428 ,  H05K3/4697 ,  H05K2201/09036 ,  H05K2201/09127 ,  H05K2201/09781 ,  H05K2203/0554 ,  Y10T29/49155 ,  Y10T29/49156

Abstract: A manufacturing method of a circuit board is provided. Providing a substrate, where a first laser resistant structure is disposed on a first dielectric layer and at the periphery of a pre-removing area, a second dielectric layer covers the first laser resistant structure, a circuit layer is disposed on the second dielectric layer, a second laser resistant structure is disposed on the second dielectric layer and at the periphery of the pre-removing area, a third dielectric layer covers the circuit layer and the second laser resistant structure. There are gaps between the second laser resistant structure and the circuit layer, and the vertical projection of the gaps on the first dielectric layer overlaps the first laser resistant structure. A laser machining process is performed to etch the third dielectric layer at the periphery of the pre-removing area. The portion of the third dielectric layer within the pre-removing area is removed.

Abstract translation: 提供电路板的制造方法。 提供一种基板，其中第一耐光结构设置在第一电介质层上并在预除去区域的周围，第二介电层覆盖第一耐光结构，电路层设置在第二介电层上， 第二激光结构被设置在第二介质层上，并且在预除去区域的周围，第三介电层覆盖电路层和第二激光结构。 第二激光电阻结构和电路层之间存在间隙，并且第一电介质层上的间隙的垂直投影与第一耐磨结构重叠。 执行激光加工处理以在预除去区域的周边蚀刻第三介电层。 除去去除区域内的第三电介质层的部分。

公开(公告)号：US20130276969A1

公开(公告)日：2013-10-24

申请号：US13919711

申请日：2013-06-17

Applicant: Unimicron Technology Corp.

Inventor： Chen-Chuan Chang

IPC: B32B38/10

CPC classification number: B32B38/10 ,  H05K3/4623 ,  H05K3/4652 ,  H05K3/4697 ,  H05K2201/0355 ,  H05K2201/09127 ,  H05K2203/107 ,  Y10T156/1052

Abstract: A manufacturing method of a circuit board comprises the following steps. Firstly, provide a first core layer, a second core material layer, and a central dielectric material layer. Secondly, press the first core layer, the second core material layer, and the central dielectric material layer to form a composite circuit structure. Thirdly, removing a portion of the central dielectric material layer located at a periphery of a pre-removing area and a portion of the second core material layer located at the periphery of the pre-removing area. Finally, remove a portion of the central dielectric material layer located within the pre-removing area and a portion of the second core material layer located within the pre-removing area to form a central dielectric layer and a second core layer.

Abstract translation: 电路板的制造方法包括以下步骤。 首先，提供第一芯层，第二芯材料层和中心电介质材料层。 其次，按压第一芯层，第二芯材料层和中心电介质材料层以形成复合电路结构。 第三，去除位于预除去区域的周边的中央电介质材料层的一部分和位于预除去区域周边的第二芯材料层的一部分。 最后，去除位于预除去区域内的中心电介质材料层的一部分和位于预去除区域内的第二芯材料层的一部分以形成中心电介质层和第二芯层。

公开(公告)号：US09084342B2

公开(公告)日：2015-07-14

申请号：US13846871

申请日：2013-03-18

Applicant: Unimicron Technology Corp.

Inventor： Chen-Chuan Chang

IPC: H05K3/00 ,  H05K3/42 ,  H05K3/10 ,  H05K3/06 ,  H05K3/46 ,  H05K1/18

CPC classification number: H05K3/007 ,  H05K1/183 ,  H05K3/0035 ,  H05K3/06 ,  H05K3/062 ,  H05K3/108 ,  H05K3/428 ,  H05K3/4697 ,  H05K2201/09036 ,  H05K2201/09127 ,  H05K2201/09781 ,  H05K2203/0554 ,  Y10T29/49155 ,  Y10T29/49156

Abstract: A manufacturing method of a circuit board is provided. Providing a substrate, where a first laser resistant structure is disposed on a first dielectric layer and at the periphery of a pre-removing area, a second dielectric layer covers the first laser resistant structure, a circuit layer is disposed on the second dielectric layer, a second laser resistant structure is disposed on the second dielectric layer and at the periphery of the pre-removing area, a third dielectric layer covers the circuit layer and the second laser resistant structure. There are gaps between the second laser resistant structure and the circuit layer, and the vertical projection of the gaps on the first dielectric layer overlaps the first laser resistant structure. A laser machining process is performed to etch the third dielectric layer at the periphery of the pre-removing area. The portion of the third dielectric layer within the pre-removing area is removed.

Abstract translation: 提供电路板的制造方法。 提供一种基板，其中第一耐光结构设置在第一电介质层上并在预除去区域的周围，第二介电层覆盖第一耐光结构，电路层设置在第二介电层上， 第二激光结构被设置在第二介质层上，并且在预除去区域的周围，第三介电层覆盖电路层和第二激光结构。 第二激光电阻结构和电路层之间存在间隙，并且第一电介质层上的间隙的垂直投影与第一耐磨结构重叠。 执行激光加工处理以在预除去区域的周边蚀刻第三介电层。 除去去除区域内的第三电介质层的部分。