公开(公告)号：US11424216B2

公开(公告)日：2022-08-23

申请号：US17030380

申请日：2020-09-24

Applicant: Unimicron Technology Corp.

Inventor： Chia-Fu Hsu ,  Kai-Ming Yang ,  Pu-Ju Lin ,  Cheng-Ta Ko

IPC: H01L23/48 ,  H01L23/00

Abstract: A fabrication method of an electronic device bonding structure includes the following steps. A first electronic component including a first conductive bonding portion is provided. A second electronic component including a second conductive bonding portion is provided. A first organic polymer layer is formed on the first conductive bonding portion. A second organic polymer layer is formed on the second conductive bonding portion. Bonding is performed on the first electronic component and the second electronic component through the first conductive bonding portion and the second conductive bonding portion, such that the first electronic component and the second electronic component are electrically connected. The first organic polymer layer and the second organic polymer layer diffuse into the first conductive bonding portion and the second conductive bonding portion after the bonding. An electronic device bonding structure is also provided.

公开(公告)号：US20220068872A1

公开(公告)日：2022-03-03

申请号：US17030380

申请日：2020-09-24

Applicant: Unimicron Technology Corp.

Inventor： Chia-Fu Hsu ,  Kai-Ming Yang ,  Pu-Ju Lin ,  Cheng-Ta Ko

IPC: H01L23/00

Abstract: A fabrication method of an electronic device bonding structure includes the following steps. A first electronic component including a first conductive bonding portion is provided. A second electronic component including a second conductive bonding portion is provided. A first organic polymer layer is formed on the first conductive bonding portion. A second organic polymer layer is formed on the second conductive bonding portion. Bonding is performed on the first electronic component and the second electronic component through the first conductive bonding portion and the second conductive bonding portion, such that the first electronic component and the second electronic component are electrically connected. The first organic polymer layer and the second organic polymer layer diffuse into the first conductive bonding portion and the second conductive bonding portion after the bonding. An electronic device bonding structure is also provided.