公开(公告)号：US20230124732A1

公开(公告)日：2023-04-20

申请号：US17745809

申请日：2022-05-16

Applicant: Unimicron Technology Corp.

Inventor： Heng-Ming Nien ,  Chih-Chiang Lu ,  Cho-Ying Wu ,  Shih-Lian Cheng

IPC: C25D5/00

Abstract: An electroplating apparatus including an anode and a cathode, a power supply, and a regulating plate is provided. The power supply is electrically connected to the anode and the cathode. The regulating plate is arranged between the anode and the cathode. The regulating plate includes an insulating grid plate and a plurality of magnetic components. The plurality of magnetic components are uniformly and randomly arranged on the insulating grid plate. An electroplating method is also provided.

公开(公告)号：US11686008B2

公开(公告)日：2023-06-27

申请号：US17745809

申请日：2022-05-16

Applicant: Unimicron Technology Corp.

Inventor： Heng-Ming Nien ,  Chih-Chiang Lu ,  Cho-Ying Wu ,  Shih-Lian Cheng

IPC: C25D5/00 ,  C25D17/00

CPC classification number: C25D5/007 ,  C25D17/007

Abstract: An electroplating apparatus including an anode and a cathode, a power supply, and a regulating plate is provided. The power supply is electrically connected to the anode and the cathode. The regulating plate is arranged between the anode and the cathode. The regulating plate includes an insulating grid plate and a plurality of magnetic components. The plurality of magnetic components are uniformly and randomly arranged on the insulating grid plate. An electroplating method is also provided.

公开(公告)号：US20230120741A1

公开(公告)日：2023-04-20

申请号：US17700531

申请日：2022-03-22

Applicant: Unimicron Technology Corp.

Inventor： Heng-Ming Nien ,  Cho-Ying Wu ,  Shih-Lian Cheng

IPC: C25D17/02 ,  C25D17/10 ,  C25D21/12

Abstract: Provided is an electroplating apparatus including an electroplating tank, an anode and a cathode, a power supply, and a regulating plate. The electroplating tank accommodates electrolyte. Both the anode and the cathode are disposed in the electroplating tank. The power supply is electrically connected to the anode and the cathode. The regulating plate is disposed between the anode and the cathode. The regulating plate includes a plurality of mesh openings and a plurality of metal sheets, and at least part of the metal sheets is electrically connected with the cathode. An electroplating method is also provided.