公开(公告)号：US09806050B2

公开(公告)日：2017-10-31

申请号：US14742672

申请日：2015-06-17

Applicant: Unimicron Technology Corp.

Inventor： Pao-Hung Chou ,  Chih-Hao Hsu

IPC: H05K3/36 ,  H01L23/00 ,  H01L21/56 ,  H01L21/683 ,  H01L23/31

CPC classification number: H01L24/19 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3128 ,  H01L24/20 ,  H01L24/83 ,  H01L2221/68372 ,  H01L2224/12105 ,  H01L2224/24227 ,  H01L2224/92244 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15747 ,  H01L2924/18162 ,  Y10T29/49126 ,  H01L2924/00

Abstract: A package structure includes: a first dielectric layer having a first surface and a second surface opposing the first surface; a semiconductor chip embedded in the first dielectric layer in a manner that the semiconductor chip protrudes from the second surface, and having an active surface and an inactive surface opposing the active surface, electrode pads being disposed on the active surface and in the first dielectric layer, the inactive surface and a part of a side surface adjacent the inactive surface protruding from the second surface; a first circuit layer disposed on the first surface; a built-up structure disposed on the first surface and the first circuit layer; and an insulating protective layer disposed on the built-up structure, a plurality of cavities being formed in the insulating protective layer for exposing a part of a surface of the built-up structure. The package structure includes only one built-up structure.

公开(公告)号：US20150287691A1

公开(公告)日：2015-10-08

申请号：US14742672

申请日：2015-06-17

Applicant: Unimicron Technology Corp.

Inventor： Pao-Hung Chou ,  Chih-Hao Hsu

IPC: H01L23/00

CPC classification number: H01L24/19 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3128 ,  H01L24/20 ,  H01L24/83 ,  H01L2221/68372 ,  H01L2224/12105 ,  H01L2224/24227 ,  H01L2224/92244 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/15153 ,  H01L2924/1517 ,  H01L2924/15747 ,  H01L2924/18162 ,  Y10T29/49126 ,  H01L2924/00

Abstract: A package structure includes: a first dielectric layer having a first surface and a second surface opposing the first surface; a semiconductor chip embedded in the first dielectric layer in a manner that the semiconductor chip protrudes from the second surface, and having an active surface and an inactive surface opposing the active surface, electrode pads being disposed on the active surface and in the first dielectric layer, the inactive surface and a part of a side surface adjacent the inactive surface protruding from the second surface; a first circuit layer disposed on the first surface; a built-up structure disposed on the first surface and the first circuit layer; and an insulating protective layer disposed on the built-up structure, a plurality of cavities being formed in the insulating protective layer for exposing a part of a surface of the built-up structure. The package structure includes only one built-up structure.

Abstract translation: 封装结构包括：具有第一表面和与第一表面相对的第二表面的第一介电层; 半导体芯片以半导体芯片从第二表面突出的方式嵌入第一电介质层中，并且具有与有源表面相对的有源表面和非活性表面，电极焊盘设置在有源表面和第一介电层中 ，所述非活性表面和与从所述第二表面突出的所述非活性表面相邻的侧表面的一部分; 设置在所述第一表面上的第一电路层; 设置在所述第一表面和所述第一电路层上的积层结构; 以及设置在所述积层结构上的绝缘保护层，在所述绝缘保护层中形成多个空腔，用于暴露所述积层结构的表面的一部分。 封装结构仅包括一个构建结构。