公开(公告)号：US12185479B2

公开(公告)日：2024-12-31

申请号：US17945106

申请日：2022-09-15

Applicant: Unimicron Technology Corp.

Inventor： Cheng-Ta Ko ,  Pu-Ju Lin ,  Shih-Chieh Chen ,  Chi-Hai Kuo ,  Jeng-Ting Li

IPC: H05K1/03 ,  H05K1/11 ,  H05K3/06 ,  H05K3/46

Abstract: A flexible circuit board and a manufacturing method thereof are provided. The flexible circuit board includes a circuit structure, a first cover layer, and a second cover layer. The circuit structure has a top surface and a bottom surface opposite to the top surface. The circuit structure includes multiple circuit layers and multiple insulating layers stacked alternately. A material of the insulating layers is a photosensitive dielectric material and a Young's modulus of the insulating layers is between 0.36 GPa and 8 GPa. The first cover layer is disposed on the top surface of the circuit structure. The second cover layer is disposed on the bottom surface of the circuit structure.

公开(公告)号：US20230164928A1

公开(公告)日：2023-05-25

申请号：US17945106

申请日：2022-09-15

Applicant: Unimicron Technology Corp.

Inventor： Cheng-Ta Ko ,  Pu-Ju Lin ,  Shih-Chieh Chen ,  Chi-Hai Kuo ,  Jeng-Ting Li

IPC: H05K3/46 ,  H05K1/03 ,  H05K1/11 ,  H05K3/06

CPC classification number: H05K3/4691 ,  H05K1/0393 ,  H05K1/118 ,  H05K3/06 ,  H05K2201/0154 ,  H05K2201/09509

Abstract: A flexible circuit board and a manufacturing method thereof are provided. The flexible circuit board includes a circuit structure, a first cover layer, and a second cover layer. The circuit structure has a top surface and a bottom surface opposite to the top surface. The circuit structure includes multiple circuit layers and multiple insulating layers stacked alternately. A material of the insulating layers is a photosensitive dielectric material and a Young's modulus of the insulating layers is between 0.36 GPa and 8 GPa. The first cover layer is disposed on the top surface of the circuit structure. The second cover layer is disposed on the bottom surface of the circuit structure.