公开(公告)号：US20220199513A1

公开(公告)日：2022-06-23

申请号：US17654405

申请日：2022-03-11

Applicant: Unimicron Technology Corp.

Inventor： Chun-Hao CHEN ,  Chia-Lung LIN ,  Chien-Hsiang CHOU ,  Yi-Lin CHIANG ,  Chien-Chen LIN

IPC: H01L23/498 ,  H01L21/48 ,  H05K1/11 ,  H05K3/06

Abstract: A wiring board includes an insulating layer, a wiring layer and a plurality of conductive columns. The insulating layer has a first surface and a second surface opposite to the first surface. The wiring layer is disposed in the insulating layer and has a third surface and a fourth surface opposite to the third surface. The insulating layer covers the third surface, and the second surface of the insulating layer is flush with the fourth surface of the wiring layer. The conductive columns are disposed in the insulating layer and connected to the wiring layer. The conductive columns extend from the third surface of the wiring layer to the first surface of the insulating layer, and protrude from the first surface.