公开(公告)号：US20230235444A1

公开(公告)日：2023-07-27

申请号：US18184423

申请日：2023-03-15

Applicant: University of Northern Iowa Research Foundation

Inventor： ANDREW STOLLENWERK ,  TIMOTHY KIDD

IPC: C23C14/18 ,  C23C14/30 ,  C23C14/34 ,  C23C14/58 ,  C23C14/00

CPC classification number: C23C14/185 ,  C23C14/30 ,  C23C14/34 ,  C23C14/5806 ,  C23C14/0005

Abstract: The present disclosure relates generally to thin metal films having an ultra-flat surface and methods of their preparation. In particular, the ultra-flat thin metal films comprise FCC metals. Preferably, the thin metal films are attached to a substrate. Preferred substrates comprise chalcogenides and dichalcogenides. Beneficially, the thin metal films described herein can be prepared at ambient temperatures.