DEGRADABLE POLYIMIDES FOR FLEXIBLE ELECTRONIC SUBSTRATES USING THIOL-ENE CLICK CHEMISTRY

    公开(公告)号:US20240409690A1

    公开(公告)日:2024-12-12

    申请号:US18737657

    申请日:2024-06-07

    Abstract: Disclosed herein is a degradable polyimide substrate that may be reliably used as an electronic substrate in flexible electronics. The degradable polyimide substrate is formed via thiol-ene click chemistry reactions between diallyl imide or other alkene monomers and thiol monomers, that can be activated by photoirradiation at relatively low temperatures (e.g., about 80° C.). As a result, the degradable polyimide substrates disclosed herein may be cured using a simple, energy efficient curing process that allows for streamlined manufacturing of circuits including multilayered circuits. In some instances, epoxy monomers may be added to the monomer resin used to form the polyimide substrate, wherein selective curing may yield polymer substrates with varying degrees of flexibility and rigidity.

    ULTRA TOUGH GLASSY THERMOSET SYNTHESIZED USING A CURABLE LIQUID RESIN

    公开(公告)号:US20250092201A1

    公开(公告)日:2025-03-20

    申请号:US18884788

    申请日:2024-09-13

    Abstract: Disclosed herein are polyamide substrates that may be reliably used in additive manufacturing to produce a wide variety of 3D printed articles, protective films or membranes. The polyamide substrate can be formed via thiol-ene click chemistry reactions between diallyl amide or other alkene monomers, reacted with thiol monomers, that can be activated by photoirradiation at relatively low temperatures (e.g., about 80° C.). As a result, the polyamide substrates disclosed herein may be cured using a simple, energy efficient curing process that allows for additive manufacturing where the produced 3d printed article exhibits increased toughness rather than being brittle as are most 3d printed articles.

Patent Agency Ranking