公开(公告)号：US20220390833A1

公开(公告)日：2022-12-08

申请号：US17338118

申请日：2021-06-03

Applicant: VIAVI SOLUTIONS INC.

Inventor： Riberet ALMEIDA

IPC: G03F7/00 ,  G03F7/039 ,  G03F7/16

Abstract: A method of replicating a microstructure pattern includes providing a multilayer structure including a substrate, a thin film, and a positive tone photoresist; providing a mold having a microstructure pattern; applying the mold to the multilayer structure under pressure and temperature; wherein the microstructure pattern of the mold is replicated onto the positive tone photoresist of the multilayer structure. An article including a substrate, and a thin film having a microstructure pattern is also disclosed.

公开(公告)号：US20230358925A1

公开(公告)日：2023-11-09

申请号：US17737865

申请日：2022-05-05

Applicant: VIAVI SOLUTIONS INC.

Inventor： Riberet ALMEIDA ,  Tasso R.M. SALES ,  Jaroslaw ZIEBA ,  Kangning LIANG

IPC: G02B5/02 ,  G03F7/00 ,  G02B5/00

CPC classification number: G02B5/003 ,  G02B5/0215 ,  G03F7/0002 ,  G02B1/002

Abstract: A die including a substrate; and a plurality of optical elements on a portion of a surface of the substrate; in which each optical element, of the plurality of optical elements, includes at least one optical function; and in which each optical element, of the plurality of optical elements, is separated one from another by a barrier material is disclosed. A wafer including a plurality of dies; a method of making a wafer; and a method of making a die are also disclosed.

公开(公告)号：US20230356438A1

公开(公告)日：2023-11-09

申请号：US17737898

申请日：2022-05-05

Applicant: VIAVI SOLUTIONS INC

Inventor： Riberet ALMEIDA ,  Tasso R.M. SALES ,  Jaroslaw ZIEBA ,  Kangning LIANG

IPC: B29C33/00 ,  B29C33/42 ,  B29C33/40 ,  B29C33/38

CPC classification number: B29C33/405 ,  B29C33/0011 ,  B29C33/3892 ,  B29C33/42 ,  B29C2033/0005 ,  B29C2033/0094 ,  B29L2011/00

Abstract: A soft mold tool including an elastomeric material; and a photomask; wherein the photomask is positioned within the elastomeric material is disclosed. Additionally, a soft mold tool, including an elastomeric material; and an opaque material on a portion of a surface of the elastomeric material is disclosed. A method of making the soft mold tool is also disclosed.

公开(公告)号：US20220390839A1

公开(公告)日：2022-12-08

申请号：US17338144

申请日：2021-06-03

Applicant: VIAVI SOLUTIONS INC.

Inventor： Riberet ALMEIDA

IPC: G03F7/00 ,  G03F7/09

Abstract: A method includes providing a first multilayer structure including a substrate, a thin film, and a first photoresist layer; providing a second multilayer structure including a mold having a microstructure pattern, and a second photoresist layer; combining the first multilayer structure and the second multilayer structure so that the first photoresist layer is in contact with the second photoresist layer; and applying pressure and temperature. An article including a microstructure pattern is also disclosed.