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公开(公告)号：US20240230965A9
公开(公告)日：2024-07-11
申请号：US17972453
申请日：2022-10-24
Applicant: VIAVI SOLUTIONS INC.
Inventor： Joerg BUTH , Jaroslaw ZIEBA , Bradley John WARD , Tasso R.M. SALES
CPC classification number: G02B5/0268 , G02B7/008
Abstract: A die including a substrate having a surface defined by paired oppositely-oriented edges; and an optical material, in a non-rectangular shape, and on the surface of the substrate; wherein the optical material does not extend an entire length of any one of the paired oppositely-oriented edges is disclosed, A wafer can including a plurality of the dies. Methods of making the wafer and the die are also disclosed.
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公开(公告)号：US20240134094A1
公开(公告)日：2024-04-25
申请号：US17972453
申请日：2022-10-23
Applicant: VIAVI SOLUTIONS INC.
Inventor： Joerg BUTH , Jaroslaw ZIEBA , Bradley John WARD , Tasso R.M. SALES
CPC classification number: G02B5/0268 , G02B7/008
Abstract: A die including a substrate having a surface defined by paired oppositely-oriented edges; and an optical material, in a non-rectangular shape, and on the surface of the substrate; wherein the optical material does not extend an entire length of any one of the paired oppositely-oriented edges is disclosed, A wafer can including a plurality of the dies. Methods of making the wafer and the die are also disclosed.
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