Abstract:
A strain gage of the electrical resistance type is disclosed herein which has improved adhesive means to attaching the gage to a member under test. The adhesive is applied to the gage at the time of manufacture and includes a thermosetting adhesive composition which is substantially nontacky at room temperature, and upon heating to a first elevated temperature wets the surface of the test piece in contact therewith and when heated to a second higher temperature, is converted to the infusible, insoluble state.