公开(公告)号：US11867852B1

公开(公告)日：2024-01-09

申请号：US18340396

申请日：2023-06-23

Applicant: Vector Atomic, Inc.

Inventor： Matthew Todd Cashen ,  Martin Machai Boyd ,  Christopher Scott Corder

IPC: G21K1/02 ,  G01T3/00

CPC classification number: G01T3/00

Abstract: Embodiments herein describe an atomic sensor that includes a photonic die that outputs optical signals on a top surface. These optical signals can be directed and shaped as needed to satisfy a particular type of atomic sensor. In one embodiment, an atomic source (e.g., rubidium or cesium) is disposed on the photonic chip to emit atoms when heated. A collimator can then direct the emitted atoms along a path that intersects with the optical signals. This intersection can be used to detect motion (e.g., rotation and acceleration) of the atomic sensor.