公开(公告)号：US20150041428A1

公开(公告)日：2015-02-12

申请号：US14518434

申请日：2014-10-20

Applicant: Viasystems Technologies Corp., L.L.C.

Inventor： Raj Kumar ,  Monte P. Dreyer ,  Michael J. Taylor

IPC: H05K3/46

CPC classification number: H05K3/4623 ,  H05K3/205 ,  H05K3/386 ,  H05K3/4069 ,  H05K3/423 ,  H05K3/4614 ,  H05K3/4617 ,  H05K3/462 ,  H05K2201/0355 ,  H05K2201/0394 ,  H05K2201/09309 ,  H05K2201/096 ,  H05K2203/0191 ,  H05K2203/0271 ,  H05K2203/0502 ,  H05K2203/061 ,  H05K2203/0733 ,  H05K2203/107 ,  H05K2203/1461 ,  H05K2203/1536 ,  H05K2203/304 ,  Y10T29/49126 ,  Y10T29/49155 ,  Y10T29/49165

Abstract: A method of manufacturing at least a portion of a printed circuit board. The method includes: applying a lamination adhesive on a first plural-layer substrate that includes a plurality of circuit layers with at least one first metal pad on a first side of the first plural-layer substrate; applying a protective film on the lamination adhesive; forming at least one via into the lamination adhesive to expose the at least one metal pad on the first side of the first plural-layer substrate; filling at least one conductive paste into the at least one via formed in the lamination adhesive; removing the protective film to expose the lamination adhesive on the first plural-layer substrate; and attaching the first plural-layer substrate with a second plural-layer substrate that includes a plurality of circuit layers with at least one second metal pad on a second side of the second plural-layer substrate.

Abstract translation: 一种制造印刷电路板的至少一部分的方法。 该方法包括：在第一多层基板上施加层压粘合剂，该第一多层基板包括多个电路层，在第一多层基板的第一侧具有至少一个第一金属焊盘; 在层压粘合剂上涂上保护膜; 将至少一个通孔形成到所述层压粘合剂中以暴露所述第一多层基板的第一侧上的所述至少一个金属焊盘; 将至少一个导电浆料填充到在层压粘合剂中形成的至少一个通孔中; 去除所述保护膜以将所述层叠粘合剂暴露在所述第一多层基板上; 以及在所述第二多层基板的第二面上，将具有包含多个电路层的第二多层基板与至少一个第二金属焊盘连接的第一多层基板。