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1.发明申请METHOD FOR ANCHORING A CONDUCTIVE CAP ON A FILLED VIA IN A PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD WITH AN ANCHORED CONDUCTIVE CAP 有权用于在印刷电路板和印刷电路板上填充导电盖的方法，其具有锚定导电盖公开(公告)号：US20160316563A1
公开(公告)日：2016-10-27
申请号：US14694756
申请日：2015-04-23
Applicant: Viasystems Technologies Corp., L.L.C.
Inventor： Rajwant Sidhu , Ruben Zepeda
CPC classification number: H05K3/0094 , H05K1/113 , H05K3/064 , H05K3/422 , H05K3/423 , H05K2201/09481 , H05K2201/09563 , H05K2203/095
Abstract: The present invention relates to forming an anchored cap in a filled via in a PCB. The cap is formed by making an anchor opening in the filled via, depositing copper into the anchor opening to form an anchor portion, and subsequently depositing a cap portion over the filled via and the anchor portion, so that the anchored cap is anchored to the filled via by the anchor portion. In another embodiment, the anchor portion and cap portion may be deposited in one step.
Abstract translation: 本发明涉及在PCB中的填充通孔中形成锚定盖。 盖通过在填充的通孔中形成锚定开口而形成，将铜沉积到锚定开口中以形成锚定部分，随后在填充的通孔和锚定部分上沉积盖部分，使得锚定盖被锚固到 通过锚定部分填充。 在另一个实施例中，锚定部分和盖部分可以在一个步骤中沉积。
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公开(公告)号：US09913382B2
公开(公告)日：2018-03-06
申请号：US14694756
申请日：2015-04-23
Applicant: Viasystems Technologies Corp., L.L.C.
Inventor： Rajwant Sidhu , Ruben Zepeda
CPC classification number: H05K3/0094 , H05K1/113 , H05K3/064 , H05K3/422 , H05K3/423 , H05K2201/09481 , H05K2201/09563 , H05K2203/095
Abstract: The present invention relates to forming an anchored cap in a filled via in a PCB. The cap is formed by making an anchor opening in the filled via, depositing copper into the anchor opening to form an anchor portion, and subsequently depositing a cap portion over the filled via and the anchor portion, so that the anchored cap is anchored to the filled via by the anchor portion. In another embodiment, the anchor portion and cap portion may be deposited in one step.
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