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    Bonding with a compliant medium
    2.
    发明授权
    Bonding with a compliant medium 失效
    与合规媒体联系

    公开(公告)号：US3669333A

    公开(公告)日：1972-06-13

    申请号：US3669333D

    申请日：1970-02-02

    Applicant: WESTERN ELECTRIC CO

    Inventor： COUCOULAS ALEXANDER

    IPC: B23K20/00 ,  B23K20/10 ,  H01L21/00 ,  B23K21/00

    CPC classification number: H01L21/67144 ,  B23K20/007 ,  B23K20/10 ,  H01L24/75 ,  H01L2224/13144 ,  H01L2224/75315 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/00

    Abstract: A plurality of independently displaceable pins are employed to apply bonding pressure to a compliant medium at widely spaced bonding sites. The pins permit compensation for workpiece irregularities between the bonding sites such as substrate waviness, warpage, lack of parallelism, etc., while the compliant medium compensates for localized workpiece irregularities such as variations in the thickness of leads and/or land areas.

    Abstract translation: 多个独立可移位的销用于在宽间隔的结合位置向合规介质施加结合压力。 引脚允许补偿焊接部位之间的工件不规则性，例如衬底波纹，翘曲，缺乏平行度等，而柔性介质补偿局部的工件不规则性，例如引线和/或焊盘区域的厚度变化。

    Device for bonding with a compliant medium
    4.
    发明授权
    Device for bonding with a compliant medium 失效
    用于与合规介质连接的设备

    公开(公告)号：US3650454A

    公开(公告)日：1972-03-21

    申请号：US3650454D

    申请日：1969-11-21

    Applicant: WESTERN ELECTRIC CO

    Inventor： COUCOULAS ALEXANDER

    IPC: B23K20/10 ,  H01L21/00 ,  H01L21/607 ,  B23K1/06

    CPC classification number: H01L21/67144 ,  B23K20/10 ,  H01L24/75 ,  H01L24/80 ,  H01L2224/13144 ,  H01L2224/16 ,  H01L2224/75315 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/351 ,  Y10T29/49121 ,  H01L2924/00

    Abstract: The bonding of two workpieces by ultrasonic or thermocompression techniques requires the use of a rigid bonding tip or ram to transmit the bonding energy, whether it be vibratory, mechanical and/or thermal. In time, such a rigid medium is subject to wear, to mis-alignment and to pickup of material from the workpieces, the latter causing the upper workpiece to stick to the tip. Further, such a rigid medium cannot be used reliably to make a number of bonds simultaneously, because minor size differences in the workpieces can prevent a good couple for energy transmission from being established to every workpiece. It has been discovered that a compliant or deformable medium can be employed to hold the workpieces during bonding. By deforming around the workpieces, the compliant medium eliminates the problem of size differences, as well as wear, mis-alignment and the like, and a good bond is achieved in each instance. In one aspect, the bonding energy is transmitted through the compliant medium to make the bond. In a second aspect, the bonding energy is transmitted through the support for the workpieces. The quality of individual bonds is improved because, for a given set of bonding conditions, there is less deformation of the workpieces than with conventional techniques. The invention is particularly applicable to the bonding of beam-lead transistors and integrated circuits to substrates, to bonding a plurality of leads to integrated circuit and thin film devices, and to bonding brittle single crystal chips to substrates.

    Abstract translation: 通过超声波或热压技术接合两个工件需要使用刚性接合尖端或压头来传递接合能量，无论是振动的，机械的和/或热的。 在时间上，这样的刚性介质经受磨损，错误对准和从工件拾取材料，后者导致上部工件粘附到尖端。 此外，这种刚性介质不能可靠地用于同时进行多个粘合，因为工件中的小尺寸差异可以防止建立到每个工件的良好的能量传输对。 已经发现，可以采用柔性或可变形的介质来在接合期间保持工件。 通过围绕工件变形，柔性介质消除了尺寸差异以及磨损，错配等问题，并且在每种情况下实现了良好的粘结。 在一个方面，结合能通过柔性介质传递以形成结合。 在第二方面，结合能通过用于工件的支撑件传递。 改善了单个结合的质量，因为对于给定的粘结条件，与常规技术相比，工件的变形较小。 本发明特别适用于将光束引线晶体管和集成电路接合到衬底，将多个引线接合到集成电路和薄膜器件，以及将脆性单晶芯片接合到衬底。

    Bonding with a compliant medium
    5.
    发明授权
    Bonding with a compliant medium 失效
    与合规媒体联系

    公开(公告)号：US3533155A

    公开(公告)日：1970-10-13

    申请号：US3533155D

    申请日：1967-07-06

    Applicant: WESTERN ELECTRIC CO

    Inventor： COUCOULAS ALEXANDER

    IPC: B23K20/10 ,  H01L21/00 ,  H01L21/60 ,  H01L21/607 ,  H01R12/55 ,  B23K31/02

    CPC classification number: H01L24/85 ,  B23K20/10 ,  H01L21/67144 ,  H01L24/45 ,  H01L24/48 ,  H01L24/75 ,  H01L2224/45124 ,  H01L2224/48699 ,  H01L2224/75315 ,  H01L2224/78 ,  H01L2224/85 ,  H01L2224/85203 ,  H01L2224/85205 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/01022 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01031 ,  H01L2924/01039 ,  H01L2924/01042 ,  H01L2924/01047 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/10253 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/351 ,  H01L2924/00014 ,  H01L2924/00

    Abstract: 1,239,631. Welding by pressure. WESTERN ELECTRIC CO. Inc. 1 July, 1968 [6 July, 1967], No. 31259/68. Heading B3R. [Also in Division H1] In bonding a workpiece to a substrate, pressure is applied to the workpiece positioned on the substrate through an elastically or plastically compliant means and bonding of the workpiece to the substrate is effected by thermocompression or ultrasonic bonding, the compliant means being subsequently removed. A gold lead 14, Fig. 1A, to be bonded to a gold land 12 on a high alumina ceramic substrate 10 is placed on the land and a wire 16 of aluminium is clamped on the lead 14 by a heated ram 18 with the substrate 10 on a rigid support. The wire 16 deforms around the lead which also deforms and when a bonding is complete the wire is deformed to completely cover the bond area on both workpieces the bond being by diffusion. An exact replica of the bond area is left on the wire when removed. The wire does not bond to the lead because of its oxide film and similar film forming metal, e.g. nickel, titanium and tantalum may be used for the wire 16. In bonding the gold leads 30, Fig. 5, from a silicon chip 28 to the metal lands (not shown) on a substrate 32 a hollow frame 34 is placed around the clip 28 and on the leads 30 to extend above the chip. A hot ram is pressed on the frame 34 to deform the leads and frame and effect bonding. A 16 lead beam leaded device is bonded, in an example, to the Au-Ti land areas on a glass substrate using aluminium with a square hole punched therein around the device, pressure of 48 lb. being applied for 1À5 sees. by a stainless steel ram with a flat Ni-Cr-Fe tip heated by an electric cartridge heater to 400‹ C. If the leads of a strong beam lead device are to be bonded a solid sheet of compliant material covers the entire device and ram pressure is applied to deform the sheet around the device and leads. Heat for the thermo-compression bonding may be provided by hot gas, resistance heating or heating the anvil. In another arrangement a substrate 42, Fig. 8, is placed in a depression 40 in a table 38 connected to an ultrasonic vibrator horn and a beam lead device 44 is placed on the substrate, a plunger 46 having a tip 48 of electrically deformative material, e.g. silicon rubber being actuated hydraulically, by cam or by solenoid to press on the device 44. Ultrasonic energy is supplied to vibrate the table and the tip 48 deforms around the device 44 and clamps all the leads. Heat may be supplied by the plunger 46. The balled ends of two wire leads may be bonded to land areas on a substrate by two spring loaded heated plungers cooperating with an ultrasonically vibrated table. The leads of a beam lead device may be similarly bonded using a number of spring pressed plunger sheld in appropriate array on a jig plate. In bonding a silicon chip to a copper stud for use as a power rectifier the stud is supported in a recessed anvil with a brazed on molybdenum, tungsten or silver impregnated tungsten compact above the anvil surface and in contact with a metallized silicon wafer. A piece of aluminium is pressed against the water by a bonding tip which supplies ultrasonic bonding energy. Heat is also supplied. Similarly a gallium-arsenide junction laser diode metallized with gold is bonded to an Au-Ti plated substrate. A machine for use in bonding according to the invention comprises a base-plate coupled to an ultrasonic horn and having an apertured substrate receiving plate secured thereto. Vertically mounted above the base-plate by rack and pinion is an hydraulic or solenoid operated ram device for thermo-compression bonding, the tip of the ram being of plastically deformable metal, being apertured or being a flat piece of molybdenum for use with a compliant frame. For ultrasonic bonding the ram device is replaced by a frame to contain a spring loaded plunger carrying jig or by an ultrasonic horn. A binocular microscope is provided on the machine. Beam lead integrated circuits may be mounted by adhesive on an aluminium ribbon and after indexing of the ribbon the devices are bonded to a substrate by the bonding ram. In ultrasonically bonding metallized silicon chip to a substrate aluminium or P.T.F.E. may be provided between the workpiece and bonding tip.

    Assembly including carrier for devices
    6.
    发明授权
    Assembly including carrier for devices 失效
    装配包括装置的载体

    公开(公告)号：US3655177A

    公开(公告)日：1972-04-11

    申请号：US3655177D

    申请日：1969-10-20

    Applicant: WESTERN ELECTRIC CO

    Inventor： COUCOULAS ALEXANDER

    IPC: B23K20/10 ,  H01L21/00 ,  H01L21/607 ,  B25B11/00

    CPC classification number: H01L21/67144 ,  B23K20/10 ,  H01L24/75 ,  H01L24/80 ,  H01L2224/16 ,  H01L2224/75315 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01033 ,  H01L2924/01073 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/10253 ,  H01L2924/14 ,  Y10T156/1705 ,  H01L2924/00

    Abstract: U.S. Pat. No. 3,533,155, whereof this is a division, concerns a method of bonding which employs a compliant or deformable medium to hold workpiece devices during bonding, the medium transmitting bonding energy to the workpieces and deforming about the workpieces. The invention of this division relates to the compliant medium and to an assembly, useful in compliant bonding of the type described in U.S. Pat. No. 3,533,155. The assembly is provided by the compliant medium plus the devices for which the medium acts as a temporary retainer or carrier. The compliant medium takes the form of a flat sheet of a readily deformable material, such as an elongated tape or ribbon of a metal or an alloy with an oxide surface film. The medium has a thickness substantially greater than workpieces to be bonded. Upper surfaces of the workpieces are secured to the under surface of the medium, for example, by an adhesive. The workpieces are positioned in fixed relationship to one another, preferably in spaced apertures in the medium. Indexing means may also be present in the tape or ribbon of the compliant medium.

    Abstract translation: 美国专利 第3,533,155号，这是一个划分，涉及一种粘合方法，其采用柔性或可变形介质在粘合期间保持工件装置，介质将能量传递到工件并使工件变形。 该部分的发明涉及柔性介质和组件，其可用于美国专利中描述的类型的柔性结合。 第3,533,155号。 组件由柔性介质加上介质作为临时保持器或载体的装置提供。 柔性介质采用容易变形的材料的平板形式，例如金属的细长带或带或具有氧化物表面膜的合金。 该介质的厚度基本上大于待粘结的工件。 工件的上表面例如通过粘合剂固定在介质的下表面上。 工件彼此固定，优选地在介质中间隔开的孔中。 索引装置也可以存在于柔性介质的带或带中。

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