公开(公告)号：US09477344B2

公开(公告)日：2016-10-25

申请号：US14468325

申请日：2014-08-25

Applicant: WINTEK CORPORATION

Inventor： Ying-Ting Liou ,  Kai-Ting Tsai ,  Ming-Cheng Tsai ,  Chun-Ming Huang

IPC: B32B3/00 ,  G06F3/041 ,  H05K3/28 ,  G02F1/1345

CPC classification number: G06F3/0416 ,  G02F1/1345 ,  G02F2201/50 ,  H05K3/28 ,  H05K2201/10136

Abstract: A panel including a substrate, a plurality of wirings and a protection stacked layer is provided. The substrate has a device area, a bonding area and a wiring area connected between the device area and the bonding area. The wirings extend from the device area to the bonding area through the wiring area. The protection stacked layer extends from a side of the wiring area adjacent to the device area towards a side of the bonding area and is located on the wirings.

Abstract translation: 提供了包括基板，多个布线和保护层叠层的面板。 基板具有连接在装置区域和接合区域之间的装置区域，接合区域和布线区域。 布线通过布线区域从器件区域延伸到接合区域。 保护层叠层从布线区域的与设备区域相邻的一侧朝向接合区域的一侧延伸并且位于布线上。

公开(公告)号：US20150029419A1

公开(公告)日：2015-01-29

申请号：US14335959

申请日：2014-07-21

Applicant: WINTEK CORPORATION

Inventor： Chun-Ming Huang ,  Jen-Wei Chou ,  Cheng-Hsiu Liu ,  Ta-Wei Yeh

IPC: G02B5/22 ,  G06F1/16

CPC classification number: G06F1/169 ,  G06F3/03547 ,  G09F23/00 ,  Y10T428/24331 ,  Y10T428/24752 ,  Y10T428/24851

Abstract: A decoration plate includes a substrate, a decoration pattern layer, and at least one color decoration layer. The decoration pattern layer is disposed on the substrate, and the decoration pattern layer has a pattern in a projection direction perpendicular to the substrate. The color decoration layer is disposed on and covers the decoration pattern layer, and extends onto the substrate.

Abstract translation: 装饰板包括基板，装饰图案层和至少一个颜色装饰层。 装饰图案层设置在基板上，装饰图案层在垂直于基板的投影方向上具有图案。 彩色装饰层设置在覆盖装饰图案层上并延伸到基板上。

公开(公告)号：US09529460B2

公开(公告)日：2016-12-27

申请号：US14340564

申请日：2014-07-25

Applicant: WINTEK CORPORATION

Inventor： Chun-Ming Huang ,  Yi-Chun Lin ,  Yi-Chen Tsai ,  Ming-Kung Wu

IPC: H05K1/09 ,  G06F3/041 ,  B32B23/02 ,  H05K1/02 ,  H05K3/12

CPC classification number: G06F3/041 ,  G06F2203/04103 ,  H05K1/0296 ,  H05K3/12 ,  H05K2201/0326 ,  H05K2201/0329 ,  H05K2201/09045 ,  H05K2201/09154 ,  H05K2201/09681 ,  H05K2201/09727

Abstract: A panel structure includes a substrate, a decoration layer and a conductive component. The decoration layer is located in a first region and the rest region is a second region. The decoration layer includes a middle portion and a first edge protruding portion located between the middle portion and the second region and thinner than the middle portion. Each the conductive component extends in a first direction towards the first region from the second region and crosses the first edge protruding portion followed by extending in a second direction on the middle portion of the decoration layer, the first direction intersects the second direction, each the conductive component on the first edge protruding portion has a first width, each the conductive component on the middle portion extends in the second direction and has a second width less than the first width.

Abstract translation: 面板结构包括基板，装饰层和导电部件。 装饰层位于第一区域中，其余区域是第二区域。 装饰层包括位于中间部分和第二区域之间的中间部分和第一边缘突出部分，并且比中间部分薄。 每个导电部件沿着第一方向从第二区域朝向第一区域延伸，并且穿过第一边缘突出部分，然后在装饰层的中间部分上沿第二方向延伸，第一方向与第二方向相交， 第一边缘突出部分上的导电部件具有第一宽度，中间部分上的导电部件在第二方向上延伸，并且具有小于第一宽度的第二宽度。