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公开(公告)号：US20220216091A1
公开(公告)日：2022-07-07
申请号：US17610093
申请日：2020-05-05
Applicant: WITRINS S.R.O.
Inventor： Roman Franz WIESER
IPC: H01L21/683 , B25B11/00
Abstract: Vacuum clamping device for clamping workpieces, in particular for clamping flat substrates, such as wafers for example, comprising a base plate having a suction surface, wherein a plurality of suction openings are formed in the suction surface of the base plate, wherein the base plate can be connected to at least one negative-pressure device via at least one suction line, characterized in that the suction openings are arranged in a peripheral region of the suction surface of the base plate.
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