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公开(公告)号：US20160364854A1
公开(公告)日：2016-12-15
申请号：US15180837
申请日：2016-06-13
Applicant: WiTrins s.r.o
Inventor： Roman Franz Wieser
CPC classification number: G06T7/0004 , G01B11/0608 , G01B11/24 , G01N21/956 , G01N2021/95661 , G06T2207/10024 , G06T2207/10048 , G06T2207/30148 , H01L2224/48227 , H01L2224/48472 , H01L2224/49175 , H01L2224/859 , H04N5/2256 , H04N5/332 , H04N5/3692
Abstract: The invention relates to an inspection system (10) for defect analysis of a wire connection (11) between a substrate (13) and a semiconductor component (15, 16) of a product (12), the inspection system comprising a first projection device (24), a line scan camera (28) and a processing device, the first projection device having at least one slit projection means (25), the slit projection means being capable of projecting a light slit (33) onto a wire (21, 22) of the wire connection, light of the light slit reflected by the wire in a detection plane (39) of the line scan camera extending perpendicularly, preferably orthogonally to a substrate surface (14) being detectable by means of the line scan camera, analysis image information of the product being derivable from a plurality of line scan image information of the line scan camera by means of the processing device, wherein the slit projection means is arranged in relation to the line scan camera in such a manner that the light slit can be projected onto the product so as to extend within the detection plane, the inspection system comprising a second projection device, the second projection device having at least one illuminating means (27), the illuminating means being capable of projecting diffuse light onto the product, light of the diffuse light reflected by the product in the detection plane being detectable by means of the line scan camera.
Abstract translation: 本发明涉及一种用于对产品（12）的基板（13）和半导体部件（15,16）之间的导线连接（11）进行缺陷分析的检查系统（10），所述检查系统包括第一投影装置 （24），行扫描照相机（28）和处理装置，所述第一投影装置具有至少一个狭缝投影装置（25），所述狭缝投影装置能够将光狭缝（33）投射到丝线（21）上 ，22），线垂直扫描照相机的检测平面（39）中由线反射的光狭缝的光优选地垂直于衬底表面（14）可以通过线扫描照相机检测到 ，通过所述处理装置从所述行扫描照相机的多个行扫描图像信息导出所述乘积的分析图像信息，其中所述狭缝投影装置相对于所述行扫描照相机被布置成使得所述光 狭缝罐 投影到产品上以便在检测平面内延伸，检查系统包括第二投影装置，第二投影装置具有至少一个照明装置（27），该照明装置能够将漫射光投射到产品上， 由检测平面中的产品反射的漫射光的光可以通过行扫描照相机检测。
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公开(公告)号：US11804399B2
公开(公告)日：2023-10-31
申请号：US17610093
申请日：2020-05-05
Applicant: WITRINS S.R.O.
Inventor： Roman Franz Wieser
IPC: H01L21/683 , B25B11/00
CPC classification number: H01L21/6838 , B25B11/005
Abstract: Vacuum clamping device for clamping workpieces, in particular for clamping flat substrates, such as wafers for example, comprising a base plate having a suction surface, wherein a plurality of suction openings are formed in the suction surface of the base plate, wherein the base plate can be connected to at least one negative-pressure device via at least one suction line, characterized in that the suction openings are arranged in a peripheral region of the suction surface of the base plate.
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公开(公告)号：US10186025B2
公开(公告)日：2019-01-22
申请号：US15180837
申请日：2016-06-13
Applicant: WiTrins s.r.o
Inventor： Roman Franz Wieser
Abstract: The invention relates to an inspection system (10) for defect analysis of a wire connection (11) between a substrate (13) and a semiconductor component (15, 16) of a product (12), the inspection system comprising a first projection device (24), a line scan camera (28) and a processing device, the first projection device having at least one slit projection means (25), the slit projection means being capable of projecting a light slit (33) onto a wire (21, 22) of the wire connection, light of the light slit reflected by the wire in a detection plane (39) of the line scan camera extending perpendicularly, preferably orthogonally to a substrate surface (14) being detectable by means of the line scan camera, analysis image information of the product being derivable from a plurality of line scan image information of the line scan camera by means of the processing device, wherein the slit projection means is arranged in relation to the line scan camera in such a manner that the light slit can be projected onto the product so as to extend within the detection plane, the inspection system comprising a second projection device, the second projection device having at least one illuminating means (27), the illuminating means being capable of projecting diffuse light onto the product, light of the diffuse light reflected by the product in the detection plane being detectable by means of the line scan camera.
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