公开(公告)号：US11696417B2

公开(公告)日：2023-07-04

申请号：US17859449

申请日：2022-07-07

Applicant: WOLFSPEED, INC.

Inventor： Matthew Feurtado ,  Brice McPherson ,  Daniel Martin ,  Alexander Lostetter

IPC: H05K7/14 ,  H02M1/088 ,  H02M7/00 ,  H02M7/537 ,  H05K1/02 ,  H05K1/18 ,  H05K7/20 ,  H05K5/00 ,  H05K5/02 ,  H02M1/00

CPC classification number: H05K7/1432 ,  H02M1/088 ,  H02M7/003 ,  H02M7/537 ,  H05K1/0271 ,  H05K1/181 ,  H05K5/0069 ,  H05K5/0247 ,  H05K7/20509 ,  H05K7/20909 ,  H02M1/0054 ,  H05K2201/064 ,  H05K2201/10151 ,  H05K2201/10272

Abstract: A power module including at least one substrate, a housing arranged on the at least one power substrate, a first terminal electrically connected to the at least one power substrate, a second terminal including a contact surface, a third terminal electrically connected to the at least one power substrate, a plurality of power devices arranged on and connected to the at least one power substrate, and the third terminal being electrically connected to at least one of the plurality of power devices. The power module further including a base plate and a plurality of pin fins arranged on the base plate and the plurality of pin fins configured to provide direct cooling for the power module.

公开(公告)号：USD954668S1

公开(公告)日：2022-06-14

申请号：US29676416

申请日：2019-01-10

Applicant: WOLFSPEED, INC.

Designer： Matthew Feurtado ,  Daniel Martin ,  Ty McNutt ,  Brice McPherson ,  Alexander Lostetter

公开(公告)号：US20240105651A1

公开(公告)日：2024-03-28

申请号：US18530496

申请日：2023-12-06

Applicant: Wolfspeed, Inc.

Inventor： Brice McPherson ,  Daniel Martin ,  Jennifer Stabach

IPC: H01L23/00 ,  H01L25/07

CPC classification number: H01L24/09 ,  H01L24/49 ,  H01L25/072 ,  H01L23/49562 ,  H01L2224/04042 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/30101

Abstract: A package for power electronics includes a power substrate, a number of power semiconductor die, and a Kelvin connection contact. Each one of the power semiconductor die are on the power substrate and include a first power switching pad, a second power switching pad, a control pad, a semiconductor structure, and a Kelvin connection pad. The semiconductor structure is between the first power switching pad, the second power switching pad, and the control pad, and is configured such that a resistance of a power switching path between the first power switching pad and the second power switching pad is based on a control signal provided at the control pad. The Kelvin connection pad is coupled to the power switching path. The Kelvin connection contact is coupled to the Kelvin connection pad of each one of the power semiconductor die via a Kelvin conductive trace on the power substrate.

公开(公告)号：US11756910B2

公开(公告)日：2023-09-12

申请号：US17557322

申请日：2021-12-21

Applicant: Wolfspeed, Inc.

Inventor： Brice McPherson ,  Daniel Martin ,  Jennifer Stabach

IPC: H01L23/00 ,  H01L25/07 ,  H01L23/495 ,  H01L21/66

CPC classification number: H01L24/09 ,  H01L24/49 ,  H01L25/072 ,  H01L22/14 ,  H01L22/30 ,  H01L22/32 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49558 ,  H01L23/49562 ,  H01L23/49575 ,  H01L2224/04042 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/30101

Abstract: A package for power electronics includes a power substrate, a number of power semiconductor die, and a Kelvin connection contact. Each one of the power semiconductor die are on the power substrate and include a first power switching pad, a second power switching pad, a control pad, a semiconductor structure, and a Kelvin connection pad. The semiconductor structure is between the first power switching pad, the second power switching pad, and the control pad, and is configured such that a resistance of a power switching path between the first power switching pad and the second power switching pad is based on a control signal provided at the control pad. The Kelvin connection pad is coupled to the power switching path. The Kelvin connection contact is coupled to the Kelvin connection pad of each one of the power semiconductor die via a Kelvin conductive trace on the power substrate.

公开(公告)号：US11445630B2

公开(公告)日：2022-09-13

申请号：US17149815

申请日：2021-01-15

Applicant: WOLFSPEED, INC.

Inventor： Matthew Feurtado ,  Brice McPherson ,  Daniel Martin ,  Alexander Lostetter

IPC: H05K7/00 ,  H05K7/14 ,  H02M1/088 ,  H02M7/00 ,  H02M7/537 ,  H05K1/02 ,  H05K1/18 ,  H05K7/20 ,  H05K5/00 ,  H05K5/02 ,  H02M1/00

Abstract: A power module including at least one substrate, a housing arranged on the at least one power substrate, a first terminal electrically connected to the at least one power substrate, a second terminal including a contact surface, a third terminal electrically connected to the at least one power substrate, a plurality of power devices arranged on and connected to the at least one power substrate, and the third terminal being electrically connected to at least one of the plurality of power devices. The power module further including a base plate and a plurality of pin fins arranged on the base plate and the plurality of pin fins configured to provide direct cooling for the power module.

公开(公告)号：US20240292575A1

公开(公告)日：2024-08-29

申请号：US18655878

申请日：2024-05-06

Applicant: Wolfspeed, Inc.

Inventor： Daniel Martin ,  Brice McPherson ,  Alexander Lostetter

IPC: H05K7/20 ,  G01R31/40 ,  H01L25/16 ,  H02M1/00 ,  H05K1/02 ,  H05K1/18

CPC classification number: H05K7/20909 ,  H01L25/165 ,  H05K1/0271 ,  H05K1/181 ,  H05K7/20509 ,  G01R31/40 ,  H02M1/0054

Abstract: The disclosure is directed to a power module that includes at least one power substrate, a housing arranged on the at least one power substrate, and a first terminal electrically connected to the at least one power substrate. The first terminal includes a contact surface located above the housing at a first elevation. The power module includes a second terminal including a contact surface located above the housing at a second elevation different from the first elevation, a third terminal electrically connected to the at least one power substrate, and a plurality of power devices electrically connected to the at least one power substrate.

公开(公告)号：US11887953B2

公开(公告)日：2024-01-30

申请号：US17352965

申请日：2021-06-21

Applicant: Wolfspeed, Inc.

Inventor： Brice McPherson ,  Daniel Martin ,  Jennifer Stabach

IPC: H01L23/00 ,  H01L25/07 ,  H01L23/495 ,  H01L21/66

CPC classification number: H01L24/09 ,  H01L24/49 ,  H01L25/072 ,  H01L22/14 ,  H01L22/30 ,  H01L22/32 ,  H01L23/49541 ,  H01L23/49548 ,  H01L23/49558 ,  H01L23/49562 ,  H01L23/49575 ,  H01L2224/04042 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/30101

Abstract: A package for power electronics includes a power substrate, a number of power semiconductor die, and a Kelvin connection contact. Each one of the power semiconductor die are on the power substrate and include a first power switching pad, a second power switching pad, a control pad, a semiconductor structure, and a Kelvin connection pad. The semiconductor structure is between the first power switching pad, the second power switching pad, and the control pad, and is configured such that a resistance of a power switching path between the first power switching pad and the second power switching pad is based on a control signal provided at the control pad. The Kelvin connection pad is coupled to the power switching path. The Kelvin connection contact is coupled to the Kelvin connection pad of each one of the power semiconductor die via a Kelvin conductive trace on the power substrate.

公开(公告)号：US20220115346A1

公开(公告)日：2022-04-14

申请号：US17557322

申请日：2021-12-21

Applicant: Wolfspeed, Inc.

Inventor： Brice McPherson ,  Daniel Martin ,  Jennifer Stabach

IPC: H01L23/00 ,  H01L25/07

Abstract: A package for power electronics includes a power substrate, a number of power semiconductor die, and a Kelvin connection contact. Each one of the power semiconductor die are on the power substrate and include a first power switching pad, a second power switching pad, a control pad, a semiconductor structure, and a Kelvin connection pad. The semiconductor structure is between the first power switching pad, the second power switching pad, and the control pad, and is configured such that a resistance of a power switching path between the first power switching pad and the second power switching pad is based on a control signal provided at the control pad. The Kelvin connection pad is coupled to the power switching path. The Kelvin connection contact is coupled to the Kelvin connection pad of each one of the power semiconductor die via a Kelvin conductive trace on the power substrate.